Ties That Bind - Bay Area Council Economic Institute
Ties That Bind - Bay Area Council Economic Institute
Ties That Bind - Bay Area Council Economic Institute
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Investment: Building Global Businesses in a New China<br />
nue of less than $1 billion, and none had revenues greater than $100 million. In 2005 the top 32<br />
Chinese semiconductor companies had combined revenues of just over $1.5 billion, and three<br />
had revenues of $150–200 million.<br />
Cost vs. Innovation<br />
The Semiconductor Industry Association (SIA) forecasts a $249.6 billion worldwide chip market<br />
in 2006. Asia-Pacific is by far the largest regional customer for semiconductor products, having<br />
doubled its share of total global consumption from 22% in 1997 to 45% in 2005. Half of this<br />
gain occurred in 2000–2002 as a result of a major shift in electronic equipment manufacturing<br />
from the U.S. to Asia (excluding Japan), as U.S. companies outsourced portions of their production<br />
to reduce costs and gain access to emerging markets such as China. The U.S., a leading<br />
global consumer during the 1990’s, is now tied with Europe as the smallest region in terms of<br />
semiconductor sales.<br />
According to SIA, U.S. capital affiliated companies represented 35% of total leading-edge capacity<br />
in 2000, when leading edge-capacity was defined as capacity capable of producing at 0.3 microns<br />
or less. By 2005, when leading edge capacity was defined as 0.12 microns or less, that share<br />
had declined to 14%. U.S. producers, including some who have built facilities in Taiwan, China<br />
and other offshore locations, voice concern about foreign tax breaks and investment incentives<br />
that have helped transfer foundry capacity to Asia. They point to as much as a $1.1 billion cost<br />
differential to build and operate a 300-mm wafer foundry for 10 years, with 70% of that differential<br />
in tax benefits, 20% in capital grants and only 10% in relative labor costs. As a result, twothirds<br />
of such facilities planned or in operation are in Asia.<br />
Incentives aside, China currently accounts for about 25% of global chip consumption, up from<br />
7% in 2000. By 2010, however, Chinese demand is expected to account for one-third of a global<br />
market worth $300 billion. When assessing the development of China’s semiconductor industry,<br />
however, it is important to consider not only volume, but also technological level. While production<br />
by multinational corporations largely focuses on global markets, most Chinese production is<br />
for a domestic market with lower technological needs—typically a 6" wafer. While newer companies<br />
like SMIC and Grace are producing at the 8–12" level and are beginning to sell overseas,<br />
most older Chinese fabs are dated.<br />
China’s 11th Five-Year Plan, which begins in 2006, calls for a $37.5 billion investment in the<br />
domestic integrated circuit (IC)/semiconductor industry, including five IC design companies, ten<br />
200mm wafer production lines, five 300mm lines and development of the domestic equipment<br />
industry—most notably sophisticated 65-nanometer laser etching equipment for the 300mm<br />
production lines.<br />
Despite its growth, local production currently meets only 30% of China’s domestic market<br />
needs; the rest is imported. The domestic market will therefore continue to drive China’s chip<br />
production. While some Chinese firms will seek global markets, because of the gravitational pull<br />
of its domestic market Chinese chip technology is expected to lag significantly behind that of the<br />
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