Hacking the Xbox

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Hacking the Xbox: An Introduction to Reverse Engineering
reasonable fee. When getting a BGA installed, always ask for a copy of
the inspection photo for the part; the peace of mind brought by the
photo is worth the extra cost. BGA parts can also be removed and reballed,
although this process can be much more pricey than the attachment
process.
Figure B-7: Removing a chip by realloying the solder joint. (Prepare the chip pins
with soldering flux before starting this process.) (1) Melt the realloying compound
onto all of the chip pins. The realloying compound comes in wire form. (2) Heat the
blobs of metal around the chip by dragging a soldering iron through the metal. All
the realloyed solder will become molten, at which point the chip can be pushed off
its pads. (3) Clean up the realloying compound from the board and the chip by
heating it and wiping it away with a cotton swab. (4) The result, a clean chip
removal.