Hacking the Xbox

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Hacking the Xbox: An Introduction to Reverse Engineering
using a cotton swab. Then, apply a very thin layer of soldering flux to the
region and rub a clean soldering iron tip along the exposed traces. Small
amounts of solder sticking to the iron’s tip will wick onto the circuitboard
and coat the traces, preventing oxidation of the bare copper. If the iron’s tip
is too clean, apply a drop of solder to it and lightly wipe the tip off on a wet
sponge and try again. Do not attempt to tin the exposed traces with a ball of
molten solder on the tip. Excess solder will be deposited that can lead to
Figure E-2: Left, region after soldermask has been removed with fine-grit
sandpaper. Right, region after it has been tinned (reconditioned for soldering).
shorts. (Note that the soldering flux is essential for getting a uniform, thin
coating of solder on the traces. Do not skip the application of the solder
flux.) Figure E-2 illustrates what the traces will look like before and after the
tinning process.
At this point, you may want to use a continuity meter to determine an
alternate point for attaching your modification wire. Most voltmeters come
with an audible continuity meter function. When selected, a tone is emitted
from the voltmeter whenever the resistance between the probes is very low.
Vias and component leads both make good alternate attachment points.
If you decide to use a via, you must scrape the solder mask off and
Figure E-3: Using a continuity meter to find an alternate attachment point. In this
case, R7R10 turns out to be a good alternate.