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SAND2004-1319<br />

Unlimited Release<br />

Printed April 2004<br />

<strong>Mechanics</strong> <strong>and</strong> <strong>Tribology</strong> <strong>of</strong> <strong>MEMS</strong><br />

<strong>Materials</strong><br />

Michael T. Dugger, Brad L. Boyce, Thomas E. Buchheit, <strong>and</strong> Somuri V. Prasad<br />

Microsystem <strong>Materials</strong>, <strong>Tribology</strong> <strong>and</strong> Technology Department<br />

S<strong>and</strong>ia National Laboratories<br />

P.O. Box 5800<br />

Albuquerque, NM 87185-0889<br />

Abstract<br />

Micromachines have the potential to significantly impact future weapon component<br />

designs as well as other defense, industrial, <strong>and</strong> consumer <strong>prod</strong>uct applications. For both<br />

electroplated (LIGA) <strong>and</strong> surface micromachined (SMM) structural elements, the influence <strong>of</strong><br />

processing on structure, <strong>and</strong> the resultant effects on material properties are not well understood.<br />

The behavior <strong>of</strong> dynamic interfaces in present as-fabricated microsystem materials is inadequate<br />

for most applications <strong>and</strong> the fundamental relationships between processing conditions <strong>and</strong><br />

tribological behavior in these systems are not clearly defined. We intend to develop a basic<br />

underst<strong>and</strong>ing <strong>of</strong> deformation, fracture, <strong>and</strong> surface interactions responsible for friction <strong>and</strong> wear<br />

<strong>of</strong> microelectromechanical system (<strong>MEMS</strong>) materials. This will enable needed design flexibility<br />

for these devices, as well as strengthen our underst<strong>and</strong>ing <strong>of</strong> material behavior at the nanoscale.<br />

The goal <strong>of</strong> this project is to develop new capabilities for sub-microscale mechanical <strong>and</strong><br />

tribological measurements, <strong>and</strong> to exercise these capabilities to investigate material behavior at<br />

this size scale.<br />

3

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