Mechanics and Tribology of MEMS Materials - prod.sandia.gov ...
Mechanics and Tribology of MEMS Materials - prod.sandia.gov ...
Mechanics and Tribology of MEMS Materials - prod.sandia.gov ...
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microscopy studies. As a first step in this direction, we prepared FIB sections <strong>of</strong> wear scars on<br />
electr<strong>of</strong>ormed nickel <strong>and</strong> characterized the wear-induced microstructure <strong>and</strong> texture in the<br />
subsurface regions by electron backscatter diffraction, EBSD [5.13].<br />
5.3 Experimental<br />
5.3.1 Specimen preparation<br />
The Ni specimens were prepared by mimicking the LIGA process, described in detail<br />
elsewhere [5.14]. Briefly, LIGA involves creating a micromold by deep x-ray or UV<br />
lithographic techniques <strong>and</strong> filling it up with electrodeposits to create <strong>MEMS</strong> parts. In this<br />
particular study, a UV mask with a two-dimensional array <strong>of</strong> 10 mm x 10 mm squares was used<br />
to create an array <strong>of</strong> micromolds in a 500 µm thick photoresist layer on a metallized substrate<br />
(glass plus Ti/Cu/Ti metallization) by exposing it with UV radiation, followed by dissolving the<br />
exposed regions. Nickel was electroplated into the micromolds from a sulfamate bath, the<br />
chemistry <strong>of</strong> which is given elsewhere [5.14]. The PMMA sheet containing the electrodeposited<br />
Ni squares was lapped by st<strong>and</strong>ard metallographic techniques. After planarization, the<br />
photoresist mold material was dissolved leaving Ni coupons st<strong>and</strong>ing proud <strong>of</strong> the substrate. In<br />
the actual LIGA process, the electr<strong>of</strong>ormed parts may be released from the substrate. However,<br />
for the purpose <strong>of</strong> friction <strong>and</strong> wear studies, it was not necessary to release the test coupons from<br />
the substrate. The substrate was simply diced to obtain individual test coupons that are still<br />
attached to the substrate.<br />
5.3.2 <strong>Tribology</strong> Testing<br />
Friction <strong>and</strong> wear tests were performed on lapped Ni coupons fabricated by the LIGA<br />
process described above using a linear wear tester. A Si3N4 ball (3.125 mm diameter) was used<br />
as the counterface so that plastic deformation is essentially confined to the near-surface region <strong>of</strong><br />
the s<strong>of</strong>ter Ni surface. A normal load <strong>of</strong> 100 mN (10 grams) was applied by means <strong>of</strong><br />
deadweights <strong>and</strong> the friction force was measured by a transducer. The device was housed in an<br />
environmental chamber. A dry nitrogen atmosphere with oxygen content below 5 ppm was<br />
maintained in the glove box. Tests were run in unidirectional mode for 1000 cycles.<br />
5.3.3 Sample Preparation by Focused Ion Beam (FIB)<br />
Sections <strong>of</strong> wear scars on LIGA Ni coupon were prepared using a FEI DB (dual beam)<br />
235 system comprised <strong>of</strong> both FIB <strong>and</strong> high resolution SEM columns. The advantage <strong>of</strong> this<br />
instrument is that the electron column permits imaging <strong>of</strong> the sample without introducing any<br />
additional damage due to the ion beam interacting with the sample. Electron <strong>and</strong> ion beam<br />
assisted Pt deposition was utilized to minimize damage to the wear surface during FIB<br />
micromachining. Milling <strong>of</strong> cross-sections was performed with a 30 kV Ga ions. After the FIB<br />
cuts were made, the lift out technique was used where the sample was removed from the trench<br />
using a micromanipulator <strong>and</strong> placed on a carbon coated transmission electron microscope<br />
(TEM) support grid.<br />
5.3.4 Electron Backscatter Diffraction Analysis<br />
Orientation analysis was conducted in the DB 235 system at 20 KV using the HKL<br />
technology orientation mapping hardware <strong>and</strong> s<strong>of</strong>tware. Automated orientation mapping was<br />
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