2011 EMC Directory & Design Guide - Interference Technology

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testing & test equipment Hi g h P o w e r El e c t r o m a g n e t i c Thr e at s t o t h e Smart Grid Figure 2. Comparison of IEMI wideband and narrowband threats with the early-time HEMP and lightning electromagnetic fields [4]. consumer. Each large power company has a control center that works to keep the power generated and used in balance, through diverse communications networks. In addition, they use communications networks to keep track of the health of the control electronics within substations to react in case of faults or equipment failures. Figure 1 illustrates a basic power grid example with three types of power-generating plants illustrated and three types of users (residential, commercial and industrial). It should be noted that the terminology of transmission, subtransmission and distribution in the figure may vary with respect to particular voltage levels in different parts of the U.S. and the world. In addition, the IEC [3] defines a.c. high-voltage as above 100 kV, low voltage as below 1 kV, and medium voltage as in between these two levels. Additionally, the term EHV (extra high voltage) is usually defined above 345 kV, and a new term of UHV (ultra high voltage) is defined above 800 kV, both for a.c. power flow. With regard to the trends for Smart Grid, there are several aspects to consider. Due to the emphasis put on renewable sources of energy, there are large numbers of wind turbines and solar farms being built by power companies. As these forms of generation become a larger portion of the power generation availability, sensors to track the actual flow of power over short periods of time become more important (as is the reliability of the communications networks to provide this information to the control centers). In addition, forecasting of wind velocity over hours and even minutes may become important in the future. If the wind generation drops suddenly, the control center needs to have this information in order to bring up alternate power generators (or drop load) to avoid a power blackout. Another area of Smart Grid activity is to upgrade the electronics in high voltage and medium voltage substations and to develop new rapid communications methods to relay status information and to take actions when necessary. Another area of power company activity is to increase the monitoring in the distribution network to determine the location of local outages if they occur and to command the opening of sectionalizing switches if needed. A final area of Smart Grid activity involves the actual consumer of electricity through the rollout of Smart Meters. These electronic meters can communicate back to the control center through a new communications network providing information regarding the use of electricity. In addition, consumers may be given alerts regarding the use of power and changes in the price of electricity during different times of the day. There is even a concept to build in control chips for consumer appliances that would allow particular items to be turned off remotely by the power company (presumably with the permission of the consumer, with a possible benefit of lower power rates). There is work ongoing now in the Smart Grid community to develop the communications protocols for this aspect of appliance control. It should be noted that this “demand response” aspect of Smart Grid is viewed as a way to avoid building too many power plants by reducing the margin between the peak power required and the peak power available. In reviewing the paragraphs above, it is clear that the main aspect of Smart Grid is to introduce new electronics in large numbers with new ways to communicate to them. It is of some concern that with a small operational margin, if the ability to communicate is disturbed or if Smart Grid equipment is damaged, then the smaller margin that we have today would likely result in a lower reliability of operation of the power grid. As described below it will be clear that severe (yet infrequent) electromagnetic threats have the capability to both damage and disrupt the current and future power grids. HPEM Threats IEMI background To refresh the reader regarding the terminology employed here, the term Intentional Electromagnetic Interference (IEMI) refers to the deliberate attempt to produce electromagnetic radiated and/or conducted disturbances to interfere with the operation of commercial equipment or to create damage to that equipment [4-6]. This could be done for criminal or terrorist purposes, although the purpose of the technical work is to determine the feasibility of such attacks and to determine ways to detect an attack and/or to protect against the types of disturbances that might be generated. As shown in Figure 2, the IEMI environments are split into two categories known as wideband and 48 interference technology emc Directory & design guide 2011
R a da s k y testing & test equipment forward in the IEEE EMC Society, IEC SC 77C, Cigré and ITU-T and will be discussed later in this paper. Figure 3. Level of B-dot disturbance (measured) from the severe geomagnetic storm that created the blackout in the Quebec power system a few minutes earlier [8]. (Source: Metatech Corporation Applied Power Solutions) narrowband, with both normally produced at frequencies above 100 MHz. In the time domain, the peak electric HEMP background The terminology of the electromagnetic pulse has evolved over the years, but today the generic term for all types of nuclear generated electromagnetic transients is EMP. Sometimes one will see the term NEMP, which clearly identifies the particular pulse of interest as being generated by a nuclear detonation. Of interest here is the EMP created by a high-altitude burst, generally defined as one occurring at a burst height greater than 30 km. For this altitude regime, the radiation produced by the nuclear burst does not reach the Earth’s surface, but several types of intense electromagnetic signals will. Because the burst is at high altitudes (in space), this type of EMP is usually referred to as HEMP. The HEMP has three time (and frequency) portions with the early-time (E1) HEMP reachfields exposing equipment are typically higher than 10 kV/m. Standardization work dealing with IEMI is moving ADVANCED TEST SERVICES Use of this U.S. DoD image does not imply or constitute DoD endorsement. NVLAP LAB CODE 200816-0 EMI/EMC/HIRF Test Services for Aerospace and Defense L-3 Cincinnati Electronics’ experienced and NARTE-certified staff provides turnkey solutions, including comprehensive procedures and reports that complement extensive automated MIL-STD-461 and RTCA/DO-160 test capabilities. Our modern facilities include technologically advanced reverberation and semi-anechoic chambers, and our mobile services provide customers the added convenience of on-site testing. Contact us at 1-800-543-8220 or EnvSvcsSales.CE@L-3com.com. Cincinnati Electronics L-3com.com interferencetechnology.com interference technology 49
Page 1: TM 2011 EMC Directory & Design Guid
Page 6: contents2011 Interference Technolog
Page 10: from the editor A look back — and
Page 14: testing & test equipment sions is a
Page 17 and 18: CPI: Powering your world. TWTAs for
Page 20 and 21: testing & test equipment Troublesho
Page 22 and 23: testing & test equipment Troublesho
Page 24: testing & test equipment Wir e l e
Page 27 and 28: Viol e t t e testing & test equipme
Page 29 and 30: Viol e t t e testing & test equipme
Page 32: testing & test equipment M e a s ur
Page 35 and 36: H o o l ih a n testing & test equip
Page 38 and 39: testing & test equipment O n t h e
Page 40 and 41: New Military Product Highlights IFI
Page 42: testing & test equipment O n t h e
Page 45 and 46: R o drigue z testing & test equipme
Page 47 and 48: R o drigue z testing & test equipme
Page 49: EMC EMI EMP EMR EMV ESD EMCON HERF
Page 53 and 54: R a da s k y testing & test equipme
Page 60: testing & test equipment N e w EMC
Page 63 and 64: B o r g s t r o m testing & test eq
Page 69 and 70: Facility Solutions Facility Solutio
Page 71 and 72: EMI/RFI Shielding Solutions Our ext
Page 73 and 74: JAVOR standards wire of our test se
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Page 77 and 78: JAVOR is measured. Since the potent
Page 79 and 80: JAVOR standards Figure 7a. “Reali
Page 82: shielding / cables & connectors Num
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K e e bl e r, Berge r radiated emis
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surge & transients A Risk A s s e s
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surge & transients A Risk A s s e s
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filters A c c ur at e F e e d t hr
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filters M e a s ur e m e n t s a b
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H o f f m a nn, Br aun, Frech, Rus
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design EMI Sources and Their Most S
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Cover_DDG10.indd 1 TM EMC Design ..
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standards recap HBM ESD parameters
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standards recap International Organ
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standards recap noise from power li
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standards recap quality on selected
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standards recap including to addres
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professional societies Every year,
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professional societies of TechAmeri
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professional societies education, s
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government emi/emc directory Mr. Ro
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government emi/emc directory Ms. Ja
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government emi/emc directory Chief:
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products & services index products
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products & services index Electrost
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products & services index Lightning
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products & services index York EMC
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company directory company directory
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company directory AR Tech Engineere
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company directory DARE!! Instrument
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company directory DNK Metric A/S...
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company directory Instruments For I
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company directory Metal Textiles Co
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company directory Protocol Data Sys
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company directory Spira Manufacturi
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company directory VPT, Inc. .......
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