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Jahresbericht 2005 - IPHT Jena

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MAGNETIK & QUANTENELEKTRONIK / MAGNETICS & QUANTUM ELECTRONICS<br />

1.2 Scientific results<br />

1.2.1 Micro- and nanofabrication<br />

(Uwe Hübner, Ludwig Fritzsch,<br />

Solveig Anders, Jürgen Kunert)<br />

The microfabrication group is responsible for the<br />

maintenance of the existing micro- and nanotechnological<br />

fabrication processes for quantum<br />

electronic devices (SQUID sensors, voltage standard<br />

chips, Qubits) and other applications such<br />

as nanoscale calibration standards, photonic<br />

crystals and micro optical components, and for<br />

the development of technologies appropriate for<br />

new device requirements. In <strong>2005</strong>, 210 chromium<br />

masks and 240 electron beam direct writing<br />

exposure jobs were made using the ZBA 23H.<br />

120 masks were prepared by using the optical<br />

pattern generator MANN 3600. About 80 high<br />

resolution exposures were made using the<br />

e-beam-tool LION. For the further improvement<br />

of the electron beam lithography the software<br />

tool SCELETON was installed as a proximity<br />

function calculator.<br />

In <strong>2005</strong> a new DFG-project, “Electrooptically Tunable<br />

Photonic Crystals”, was started. The European<br />

project PLATON (PLAnar Technology for<br />

Optical Networks) and the R&D project “KALI II”<br />

were successfully finished. In the “KALI II” project<br />

a new type of nanoscale CD-standard for AFM<br />

and a “Nanoscale Linewidth/Pitch Standard”<br />

were realized. These standards consist of different<br />

grating structures etched in nanocrystalline<br />

silicon on a quartz substrate. They contain<br />

patterns on nanometer scale for the calibration<br />

and resolution-check of high-resolution optical<br />

microscopy techniques, such as deep ultraviolet<br />

microscopy and laser scanning microscopy.<br />

One important task of the year <strong>2005</strong> was to<br />

develop a process to reduce the standard 3.5 µm 2<br />

Nb/Al process to junction dimensions of 1 µm 2 .At<br />

the start of <strong>2005</strong> a chemical-mechanical polishing<br />

(CMP) machine was installed and the process<br />

of SiO 2-planarization on 4” wafers developed. In<br />

parallel, optical lithography using a g-line stepper<br />

(AÜR, Zeiss <strong>Jena</strong>) and the RIE process for sub-<br />

µm Nb structures were optimized. A first wafer<br />

run with test structures of SQUIDs with Josephson<br />

junctions of different dimensions down to 0.8<br />

µm showed in principal the functionality of the<br />

planarization process. However, there was a<br />

large parameter spread and a small yield, caused<br />

by an insufficient reliability and overlap accuracy<br />

of the stepper and the strong dependence of the<br />

polishing rate on topology and structure dimensions.<br />

Therefore, for the ongoing test runs new<br />

technological concepts were developed including<br />

direct e-beam exposure and the CALDERA<br />

process for the CMP step in order to overcome<br />

the dimensional effects when polishing. Fig. 1.1<br />

shows a cross section of planarized SiO 2 isolated<br />

Nb lines. The standard 3.5 µm 2 Nb/Al process<br />

for SQUIDs was upgraded by integrating<br />

Nb-oxide capacitors with specific capacitances of<br />

app. 4 fF/µm 2 for areas of up to 25 mm 2 . They are<br />

used in highly balanced gradiometers for mobile<br />

SQUID system applications. The development of<br />

large area Josephson junctions for applications<br />

as x-ray detectors in synchrotron radiation experiments<br />

was started with special emphasize on<br />

the minimization of the subgap leakage currents.<br />

The first results are promising and future work will<br />

be concentrated on the preparation of sensor<br />

arrays and the implementation of different<br />

absorber materials.<br />

Fig. 1.1: Cross section of Nb lines with planarized<br />

SiO 2 isolation.<br />

1.2.2 SQUID sensors and systems<br />

(Volkmar Schultze, Ronny Stolz,<br />

Viatcheslav Zakosarenko,<br />

Andreas Chwala, Sven Linzen,<br />

Nilolay Ukhanski, Torsten May)<br />

Except for SQIFs (Superconducting Interference<br />

Filters – a special combination of number of various<br />

SQUIDs) which are developed and produced<br />

within a long-standing cooperation with the University<br />

of Tübingen and the company QEST, all<br />

SQUID projects are based now upon the use of<br />

low temperature superconductors.<br />

In the fourth phase of the development of the<br />

LTS SQUID gradiometer system for mobile applications<br />

the second generation prototype for measuring<br />

the full tensor of the Earth’s magnetic field<br />

gradient with extremely high sensitivity was built.<br />

It features several improvements compared to its<br />

antecessors.<br />

With integrated low pass filters the frequency gap<br />

for disturbances between the system bandwidth<br />

of approximately 4 MHz and 500 MHz of the RFI<br />

screen around the cryostat could be closed.<br />

Here, the main task was the development of a<br />

technology for integrated capacitances up to 80<br />

nF. After several aborts in the past few years the<br />

successful implementation of intrinsic capacitors<br />

is a highlight in the SQUID development in <strong>2005</strong>.<br />

Now, due to these filters the new gradiometer<br />

sensors provide higher stability in environments<br />

with high frequency radiation and their intrinsic<br />

noise could be decreased down to 20 fT/(m·√Hz).<br />

The second task was to reduce the motion noise<br />

15

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