Burn-in & Test Socket Workshop - BiTS Workshop

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Factors Contributing to CAF(2)• Conductor Configuration:Most susceptibleSource:School of Materials Science & Engineering, GIT, Atlanta, GALeast susceptible• Voltage Gradient Effects: 3-8V/mils• Solder Flux/HASL(Hot Air Solder Leveling) FluidComposition:• Testing shows that polyglycols diffuse into epoxy duringsoldering and increases moisture absorption by thesubstrate.• Thermal Excursions:• Temperature , amount of polyglycol absorption• Will weaken the bonding between epoxy and glass fibersdue to difference in Coefficient of Thermal Expansion.Anthony WongHL Kon/Low KWBiTS 2003 7
Factors Contributing to CAF(3)• Cleaning:• Polyglycol residues from soldering process.• PCB Storage & Use: Ambient Humidity Effects.• Humidity threshold depends upon operating voltage andtemperature.• Moisture absorption can occur during any part of the PCB’slifetime.• PCB exposure to high humidity conditions duringtransportation and storage can be problematic.Anthony WongHL Kon/Low KWBiTS 2003 8
Page 1 and 2: Burn-in & TestSocket WorkshopMarch
Page 3 and 4: Burn-in & Test SocketWorkshopTechni
Page 5 and 6: •OverviewAgenda• Background & D
Page 7 and 8: Background & Definition• CAF is t
Page 9: Factors Contributing to CAF(1)• M
Page 13 and 14: Best Known Test Methods & Issues(1)
Page 19 and 20: Technical Challenges• CAF test st
Page 21 and 22: A g e n d aBiTS Burn-in & Test Sock
Page 23 and 24: Requirements for burn-in socketsBiT
Page 25 and 26: Fully Automated Burn-In Socket Test
Page 27 and 28: Fully Automated Burn-In Socket Test
Page 29 and 30: Burn-in Simulation IBiTS Burn-in &
Page 31 and 32: Burn-in Simulation IIIBiTS Burn-in
Page 33 and 34: Loader/Unloader Simulation IBiTS Bu
Page 35 and 36: Loader/Unloader Simulation IIIBiTS
Page 37 and 38: Loader/Unloader Simulation VBiTS Bu
Page 39 and 40: Loader/Unloader Simulation VIIBiTS
Page 41 and 42: OutlookBiTS Burn-in & Test Socket W
Page 43 and 44: Outline• Brief introduction of th
Page 45 and 46: Computers and PowerNot a New proble
Page 47 and 48: Some Types of PackagesCeramic LGA w
Page 49 and 50: Types Of SocketOpen TopNo Integral
Page 51 and 52: Thermal Difficulties• Thermal run
Page 53 and 54: Burn-inConventional System - Passiv
Page 55 and 56: Burn-inActive Thermal Control - MCC
Page 57 and 58: ConvectionHeat sink to airHeat Tran
Page 59 and 60: Thermal Issues - Heat TransferCondu
Page 61 and 62:
T (Ambient)Temp of airThermal Resis
Page 63 and 64:
Thermal Testing Standards- SEMITest
Page 65 and 66:
Wind TunnelThermal Imaging CameraWo
Page 67 and 68:
Thermal Test ChipSuppliersDelphi:ht
Page 69 and 70:
Thermal Test ChipPackagingCeramic L
Page 71 and 72:
Thermal Test Chip1,3 3,31,1 3,1•
Page 73 and 74:
ExampleTemperature Distribution on
Page 75 and 76:
ResultsSocket Modifications - Lidde
Page 77 and 78:
ResultsThermal Image - Lidded Packa
Page 79 and 80:
ResultsThermal Image Lidless Packag
Page 81 and 82:
ResultsExperimental Thermal Image o
Page 83 and 84:
ExampleUse of Thermal Imaging to Re
Page 85:
AcknowledgementsWork presented here
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