Burn-in & Test Socket Workshop - BiTS Workshop

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Experimental Tools– Thermal ImagingAdvantagesBest method for determining temperature fieldsNon contact, Non invasiveProvides pictorial representation of thermalinteraction of different parts of the socketFull field visibility – not temperature of adiscrete pointDifficultiesEmissivity of different surfaces and materials.Thermal Testing of Burn-in Sockets – Forster et al. BiTS Workshop, Phoenix, Az March 2 - 5, 2003 31
ExampleTemperature Distribution on PackageObjective:Method:Evaluate temperature distributionin die due to use of 4 modulesCompare results for the lidded andlidless (bare die)Modify burn-in socket to providewindow to package.Paint socket and package with flatblack paint to eliminate emissivityproblems.Thermal Testing of Burn-in Sockets – Forster et al. BiTS Workshop, Phoenix, Az March 2 - 5, 2003 32
Page 1 and 2:
Burn-in & TestSocket WorkshopMarch
Page 3 and 4:
Burn-in & Test SocketWorkshopTechni
Page 5 and 6:
•OverviewAgenda• Background & D
Page 7 and 8:
Background & Definition• CAF is t
Page 9 and 10:
Factors Contributing to CAF(1)• M
Page 11 and 12:
Factors Contributing to CAF(3)• C
Page 13 and 14:
Best Known Test Methods & Issues(1)
Page 15 and 16:
Page 17 and 18:
Page 19 and 20:
Technical Challenges• CAF test st
Page 21 and 22: A g e n d aBiTS Burn-in & Test Sock
Page 23 and 24: Requirements for burn-in socketsBiT
Page 25 and 26: Fully Automated Burn-In Socket Test
Page 27 and 28: Fully Automated Burn-In Socket Test
Page 29 and 30: Burn-in Simulation IBiTS Burn-in &
Page 31 and 32: Burn-in Simulation IIIBiTS Burn-in
Page 33 and 34: Loader/Unloader Simulation IBiTS Bu
Page 35 and 36: Loader/Unloader Simulation IIIBiTS
Page 37 and 38: Loader/Unloader Simulation VBiTS Bu
Page 39 and 40: Loader/Unloader Simulation VIIBiTS
Page 41 and 42: OutlookBiTS Burn-in & Test Socket W
Page 43 and 44: Outline• Brief introduction of th
Page 45 and 46: Computers and PowerNot a New proble
Page 47 and 48: Some Types of PackagesCeramic LGA w
Page 49 and 50: Types Of SocketOpen TopNo Integral
Page 51 and 52: Thermal Difficulties• Thermal run
Page 53 and 54: Burn-inConventional System - Passiv
Page 55 and 56: Burn-inActive Thermal Control - MCC
Page 57 and 58: ConvectionHeat sink to airHeat Tran
Page 59 and 60: Thermal Issues - Heat TransferCondu
Page 61 and 62: T (Ambient)Temp of airThermal Resis
Page 63 and 64: Thermal Testing Standards- SEMITest
Page 65 and 66: Wind TunnelThermal Imaging CameraWo
Page 67 and 68: Thermal Test ChipSuppliersDelphi:ht
Page 69 and 70: Thermal Test ChipPackagingCeramic L
Page 71: Thermal Test Chip1,3 3,31,1 3,1•
Page 75 and 76: ResultsSocket Modifications - Lidde
Page 77 and 78: ResultsThermal Image - Lidded Packa
Page 79 and 80: ResultsThermal Image Lidless Packag
Page 81 and 82: ResultsExperimental Thermal Image o
Page 83 and 84: ExampleUse of Thermal Imaging to Re
Page 85: AcknowledgementsWork presented here
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