Burn-in & Test Socket Workshop - BiTS Workshop

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ConclusionsBiTS Burn-in & Test Socket WorkshopMarch 2-5, 2003‣ Simulations approach certain burn-in process conditions‣ Fast way to evaluate and release burn-in sockets‣ Better results for socket life time estimation‣ Better purchasing decision and recommendation‣ Better burn-in socket development together with socket suppliers -- fast customer feedback‣ Fast test of new contact types, plating etc.‣ Direct comparison of different sockets / mechanical principles /contacts / platings etc.Holger HoppePage 21 .
OutlookBiTS Burn-in & Test Socket WorkshopMarch 2-5, 2003‣ Investigation of behavior of Green Packages (TSOP and FBGA) inconventional burn-in sockets‣ Investigation of new plating types (anti-sticking)‣ Investigation of vibration stability of contacts‣ Installation of simple tester - equipment in order to apply realmemory devicesHolger HoppePage 22 .Thank you !
Page 1 and 2: Burn-in & TestSocket WorkshopMarch
Page 3 and 4: Burn-in & Test SocketWorkshopTechni
Page 5 and 6: •OverviewAgenda• Background & D
Page 7 and 8: Background & Definition• CAF is t
Page 9 and 10: Factors Contributing to CAF(1)• M
Page 11 and 12: Factors Contributing to CAF(3)• C
Page 13 and 14: Best Known Test Methods & Issues(1)
Page 19 and 20: Technical Challenges• CAF test st
Page 21 and 22: A g e n d aBiTS Burn-in & Test Sock
Page 23 and 24: Requirements for burn-in socketsBiT
Page 25 and 26: Fully Automated Burn-In Socket Test
Page 27 and 28: Fully Automated Burn-In Socket Test
Page 29 and 30: Burn-in Simulation IBiTS Burn-in &
Page 31 and 32: Burn-in Simulation IIIBiTS Burn-in
Page 33 and 34: Loader/Unloader Simulation IBiTS Bu
Page 35 and 36: Loader/Unloader Simulation IIIBiTS
Page 37 and 38: Loader/Unloader Simulation VBiTS Bu
Page 39: Loader/Unloader Simulation VIIBiTS
Page 43 and 44: Outline• Brief introduction of th
Page 45 and 46: Computers and PowerNot a New proble
Page 47 and 48: Some Types of PackagesCeramic LGA w
Page 49 and 50: Types Of SocketOpen TopNo Integral
Page 51 and 52: Thermal Difficulties• Thermal run
Page 53 and 54: Burn-inConventional System - Passiv
Page 55 and 56: Burn-inActive Thermal Control - MCC
Page 57 and 58: ConvectionHeat sink to airHeat Tran
Page 59 and 60: Thermal Issues - Heat TransferCondu
Page 61 and 62: T (Ambient)Temp of airThermal Resis
Page 63 and 64: Thermal Testing Standards- SEMITest
Page 65 and 66: Wind TunnelThermal Imaging CameraWo
Page 67 and 68: Thermal Test ChipSuppliersDelphi:ht
Page 69 and 70: Thermal Test ChipPackagingCeramic L
Page 71 and 72: Thermal Test Chip1,3 3,31,1 3,1•
Page 73 and 74: ExampleTemperature Distribution on
Page 75 and 76: ResultsSocket Modifications - Lidde
Page 77 and 78: ResultsThermal Image - Lidded Packa
Page 79 and 80: ResultsThermal Image Lidless Packag
Page 81 and 82: ResultsExperimental Thermal Image o
Page 83 and 84: ExampleUse of Thermal Imaging to Re
Page 85: AcknowledgementsWork presented here

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