Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
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The Problem• As processor speed <strong>in</strong>creases power<strong>in</strong>creases• Packages dissipate more power today – willdissipate more power tomorrow• For burn-<strong>in</strong> socket suppliers - heatgenerated dur<strong>in</strong>g burn-<strong>in</strong> of high powerpackages can lead to thermal runawaycaus<strong>in</strong>g damage the socket, the board andpotentially the oven or systemThermal <strong>Test</strong><strong>in</strong>g of <strong>Burn</strong>-<strong>in</strong> <strong>Socket</strong>s – Forster et al. <strong>BiTS</strong> <strong>Workshop</strong>, Phoenix, Az March 2 - 5, 2003 5
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