Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
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Thermal Issues – Heat TransferConduction –Through silicon to surface of package.Well understoodPhysical constantConvection –From heat s<strong>in</strong>k surface to air.Less understoodDependent on many variables.Temperature.Surface f<strong>in</strong>ish.Local flow velocityThermal <strong>Test</strong><strong>in</strong>g of <strong>Burn</strong>-<strong>in</strong> <strong>Socket</strong>s – Forster et al. <strong>BiTS</strong> <strong>Workshop</strong>, Phoenix, Az March 2 - 5, 2003 18
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