Burn-in & Test Socket Workshop - BiTS Workshop

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Fine Pitch BIB Design RulesProduct PinPitch1.27mm1.00mm0.80mm0.65mm0.50mm0.50mm0.40mmFine Pitch PCB design distancesX-Pitch(mils)5039.431.525.619.719.715.7XYZ – Holesize (mils)332515.7510.2686Z-Via orPin hole sizeY – edge to edgedistance (mils)1714.415.7515.413.711.79.7Reduction inedge to edgedistance• Y is a critical dimension; closer it is, more susceptible to CAF• Hole/Via determined by drill bit size and positional accuracy.Anthony WongHL Kon/Low KWBiTS 2003 9
Best Known Test Methods & Issues(1)• Two primary test methods for CAF testing:• Surface Insulation Resistance (SIR) Test methodintroduced by Telcordia.– GR-78-CORE (IPC-TM-650, Section 2.6.14.1)– Test for surface electro migration and for characterizingPCB laminates, soldering fluxes, solder masks &conformal coating.– Test valid for a 25 year desired minimum product life.Anthony WongHL Kon/Low KWBiTS 2003 10
Page 1 and 2: Burn-in & TestSocket WorkshopMarch
Page 3 and 4: Burn-in & Test SocketWorkshopTechni
Page 5 and 6: •OverviewAgenda• Background & D
Page 7 and 8: Background & Definition• CAF is t
Page 9 and 10: Factors Contributing to CAF(1)• M
Page 11: Factors Contributing to CAF(3)• C
Page 15 and 16: Best Known Test Methods & Issues(3)
Page 17 and 18: Best Known Test Methods & Issues(5)
Page 19 and 20: Technical Challenges• CAF test st
Page 21 and 22: A g e n d aBiTS Burn-in & Test Sock
Page 23 and 24: Requirements for burn-in socketsBiT
Page 25 and 26: Fully Automated Burn-In Socket Test
Page 27 and 28: Fully Automated Burn-In Socket Test
Page 29 and 30: Burn-in Simulation IBiTS Burn-in &
Page 31 and 32: Burn-in Simulation IIIBiTS Burn-in
Page 33 and 34: Loader/Unloader Simulation IBiTS Bu
Page 35 and 36: Loader/Unloader Simulation IIIBiTS
Page 37 and 38: Loader/Unloader Simulation VBiTS Bu
Page 39 and 40: Loader/Unloader Simulation VIIBiTS
Page 41 and 42: OutlookBiTS Burn-in & Test Socket W
Page 43 and 44: Outline• Brief introduction of th
Page 45 and 46: Computers and PowerNot a New proble
Page 47 and 48: Some Types of PackagesCeramic LGA w
Page 49 and 50: Types Of SocketOpen TopNo Integral
Page 51 and 52: Thermal Difficulties• Thermal run
Page 53 and 54: Burn-inConventional System - Passiv
Page 55 and 56: Burn-inActive Thermal Control - MCC
Page 57 and 58: ConvectionHeat sink to airHeat Tran
Page 59 and 60: Thermal Issues - Heat TransferCondu
Page 61 and 62: T (Ambient)Temp of airThermal Resis
Page 63 and 64:
Thermal Testing Standards- SEMITest
Page 65 and 66:
Wind TunnelThermal Imaging CameraWo
Page 67 and 68:
Thermal Test ChipSuppliersDelphi:ht
Page 69 and 70:
Thermal Test ChipPackagingCeramic L
Page 71 and 72:
Thermal Test Chip1,3 3,31,1 3,1•
Page 73 and 74:
ExampleTemperature Distribution on
Page 75 and 76:
ResultsSocket Modifications - Lidde
Page 77 and 78:
ResultsThermal Image - Lidded Packa
Page 79 and 80:
ResultsThermal Image Lidless Packag
Page 81 and 82:
ResultsExperimental Thermal Image o
Page 83 and 84:
ExampleUse of Thermal Imaging to Re
Page 85:
AcknowledgementsWork presented here
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