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Burn-in & Test Socket Workshop - BiTS Workshop

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Thermal <strong>Test</strong> ChipSize 22*22 mmDie composite of 34 <strong>in</strong>dividualdie5*5 Array of thermal die3 Die have smaller 4*4 arrayEach die has resistor and RTDIndividual die heaterresistance 130 ohmsThermal <strong>Test</strong><strong>in</strong>g of <strong>Burn</strong>-<strong>in</strong> <strong>Socket</strong>s – Forster et al. <strong>BiTS</strong> <strong>Workshop</strong>, Phoenix, Az March 2 - 5, 2003 29

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