e-Vap ®Introduction<strong>Thin</strong> <strong>Film</strong> <strong>Deposition</strong><strong>Thin</strong> <strong>Film</strong> <strong>Deposition</strong><strong>Thin</strong> film deposition of metallic, insulating,conductive and dielectric materials playsan important role in a large number ofmanufacturing, production and researchapplications. Resistance heating, sputteringand electron beam are the processes mostwidely used. Techniques employed toperform these processes differ in degree ofsophistication and quality of film produced.A resistance heated evaporation source isrelatively simple and inexpensive, but thematerial capacity is very small. Sputterdeposition can be used to coat large areasand complex surfaces in productioncoating environments utilizing time andpower for rate control.Electron beam evaporation is the mostversatile means of vacuum evaporationand deposition. This technique allows theproduction of thin film coatings from pureelements, including most metals, as wellas numerous alloys and compounds.Electron beam evaporation offers severaladvantages over competing processesincluding precise control of low or highdeposition rates, excellent materialutilization, co-deposition and sequentialdeposition systems and a uniform lowtemperature deposition. Electron beamoffers higher evaporation rates, freedomfrom contamination, precise rate control atvery low deposition levels, precise filmcomposition and cooler substratetemperatures. The materials used forevaporation are available in near limitlessshapes and forms, the most commonbeing pellets, slugs and disks. Since theintroduction of electron beam evaporationin the 1950s, the development of higherperformance films and complex coatingprocesses has been delayed by the lack ofmodern electron beam equipment andtechnology. MDC’s e-Vap ® product linehas taken this challenge head-on andprovides electron beam evaporationsources and control electronics thatincorporate leading edge technologiesunmatched in the industry.<strong>Thin</strong> <strong>Film</strong> Applications<strong>Thin</strong> film applications requiring electronbeam evaporation are continuallyincreasing. Applications are found in themedical, metallurgical, telecommunication,micro-electronic, optical coating andsemiconductor industries. Electron beamevaporation sources are employed in theproduction of a multitude of low and hitechproducts including: sunglasses,camera lenses, optical filters, infrareddetectors, superconductors, automotivedecorative trim, costume jewelry, corrosionresistant surfaces and many others.Electron beam deposition is ideal forresearch and production applications dueto its widespread material availability,efficient material utilization and unmatchedfilm purity and uniformity.e-Vap ® Product LineThe e-Vap ® product line is as vast as theapplications requiring electron beamevaporation. Each and every e-Vap ®source is designed to meet or surpass thestringent requirements put forth by thevacuum coating world. As a leader andinnovator in this field, MDC holds variouspatents in electron-beam evaporationtechnology. Two notable patents includeU.S. patent numbers 5,418,348 and5,473,627. The first is for MDC’s uniqueelectron source design, which incorporateshigher material capacity with adramatically smaller source footprint. Thesecond, for an ingenious coolant deliverysystem incorporated into MDC’s UHV multipocketrotary sources. e-Vap ® electronbeam sources are available in six basicsizes, called Frames, which canaccommodate small research as well aslarge production coating requirements withcrucible capacities from 2cc to 400cc. Thesources are offered individually or ascomplete turn-key, flange-mountedsystems with all necessary serviceconnections, including fluid and electricalfeedthroughs. These state-of-the-artevaporation sources are powered andcontrolled with equally advanced solidstate switching power supplies, beamsweepers and control electronics. Thehighest rated power supply is capable of a15,000 Watt output at negative 10,000Volts, fits on a standard 19" rack, is only10-1/4" tall and weighs 100 pounds.Flange-mounted units are factoryassembled and tested including allfeedthroughs. A range of standard optionsinclude a watercooled collimator roof, astepper motor indexer and aprogrammable XY sweep controller.Miniature Evaporation SystemsMiniature evaporation systems include thee-Vap ® 100, a precision wire fed electronbeam source designed specifically fordepositing monolayer thin films in ultrahighvacuum environments. It can depositrefractory metals at an atomic level.e-Vap ® 3000 is a 2cc capacity, miniatureelectron beam evaporation system with a3kW power supply. This is a versatiledeposition tool used for thin film coatingprocesses in high and ultrahigh vacuumenvironments. The e-Vap ® 3000 systemevaporates virtually all rare earth refractoryand dielectric materials. It providesresearchers a simple, relatively low-costmeans of depositing high purity thin filmcoatings.Re-Vap resistive heater sources are alsopart of the miniature product line. Thesesources are available with filament boatsor coils and oxide crucibles. Re-Vap sources are by far the most economicalmethod of depositing thin films.Evaporation MaterialsMDC e-Vap ® sources are rugged, reliableand easy to maintain. Electron beamevaporation is an extremely versatilemeans of depositing uniform high-puritythin films. Capable of reaching elevatedtemperatures in excess of 3500°C,evaporation of virtually any material can beaccomplished.The Silica, Hafnia and Magnesium Fluoridematerials shown at right were producedusing an e-Vap ® power supply, e-Vap ®Source controller and e-Vap ®Programmable Sweep Controller with astandard figure-eight pattern at 200Hzsweep frequency. The continuous andsuperior performance of this arrangementpermits the routine evaporation of theseand other difficult materials.All dimensions in this catalog are given ininches unless specified otherwise.2 Phone 800-443-8817 www.mdcvacuum.com MDC <strong>Vacuum</strong> Products Corporation
e-Vap ®IntroductionMaterial SamplesTypical e-Vap ® InstallationSilica (SiO2)Fixed-Pocket UHV SourcewithManual ControlsRotary-Pocket UHV SourcewithAutomatic ControlsSubstrate FixtureCrystal SensorFeedthroughWater CooledRoofSilica (SiO2) Carousel SourceShutterHafnia (HfO2)Single-PocketSourceMulti-PocketSource<strong>Thin</strong> <strong>Film</strong> <strong>Deposition</strong>Auto IndexerDrive<strong>Deposition</strong>Rate MonitorProgrammableX-Y Sweep<strong>Deposition</strong>Rate MonitorProgrammableX-Y SweepMagnesium Fluoride (MgF2)SourceControl ModuleSourceControl ModuleFilamentTransformerFilamentTransformerPower SupplyElectronic components fit on standard 19" rack. Filament transformer can bemounted remotely as shown or directly on source flange.MDC <strong>Vacuum</strong> Products Corporation www.mdcvacuum.com Phone 800-443-88173
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