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Electronic Parts/Guidelines - infoHouse

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1 .O Environmental Packaging Design Guide - Introduction<br />

1.1 Document Control<br />

1.2 Guidebook Abstract<br />

1.3 Guidebook Purpose<br />

.:.I<br />

This document was originated and is controlled by IBM's Worldwide Distribution<br />

Engineering Services (WDES) and is intended for the use of IBM Packaging Engi-<br />

neers, designers and our suppliers. Materials presented in this guidebook are<br />

based upon IBM business applications and may not be appropriate for all indus-<br />

tries, groups and/or businesses.<br />

This Guidebook is intended to be a dynamic and changing document and will be<br />

updated periodically. This documentation section will provide a history of all<br />

update activities by section and date.<br />

Table I. Guidebook History<br />

D8te Change<br />

05/15/90<br />

Initial Release of IBM Environmental Packaging Design Guide<br />

09/28/90<br />

06/24/93<br />

03/24/94<br />

Revise for External Publication<br />

1st Revision - Updated to reflect current environment.<br />

2nd Revision - New AFPA Symbols, LCI definitions 8 Green Labeling<br />

The Guidebook is a tool to assist electronics manufacturers' Packaging Engi-<br />

neers in their development of packaging and distribution systems. This will<br />

ensure consideration of environmental factors for the entire life cycle of their<br />

package designs and processes.<br />

The Guidebook outlines the recommendations of WDES and others on how to<br />

best improve IBM's packaging and distribution processes to address and mini-<br />

mize their impact upon the environment.<br />

The purpose of this Design Guide is to sewe as a reference and working tool for<br />

IBM Packaging and Distribution Engineers in their evaluations of packaging<br />

material and distribution process alternatives. This guidebook should help IBM<br />

and its suppliers improve their impact on the environment by:<br />

I. Eliminating ozone depleting expansion agents in packaging materials,<br />

2. Eliminating intentionally-introduced heavy metals from all IBM packaging<br />

materials,<br />

3. Eliminating the use of polybiphenyl bromides (PBBs) and polybiphenyl<br />

bromide oxides (PBBOs) from all IBM packaging materials,<br />

4. Minimizing toxic elements in packaging materials and in the byproducts of<br />

their manufacture,<br />

5. Identifying methods, processes and product and package designs to reduce<br />

the volume in the solid waste stream,

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