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i (mA/cm 2 )<br />

i (mA/cm 2 )<br />

Replated Cu<br />

Figure 7.15. Pit morphologies under polyurethane coatings on as-deposited Al-Cu thin<br />

films (left) <strong>and</strong> aged Al-Cu thin films (right) at different exposure times.<br />

(a)<br />

8<br />

(b)<br />

8<br />

7<br />

6<br />

R 2 =0.98<br />

7<br />

6<br />

R 2 =0.97<br />

5<br />

5<br />

4<br />

4<br />

3<br />

3<br />

2<br />

1<br />

i=9.38-9.78 -6 *t<br />

0<br />

0 1x10 5 2x10 5 3x10 5 4x10 5 5x10 5 6x10 5 7x10 5 8x10 5<br />

time s<br />

2<br />

1<br />

0<br />

0.0 2.0x10 5 4.0x10 5 6.0x10 5 8.0x10 5 1.0x10 6 1.2x10 6 1.4x10 6<br />

Time (s)<br />

i=a*t -0.92<br />

Figure 7.16. Anodic current densities as a function of time. (a) as-deposited thin film (b)<br />

aged thin film.<br />

5.7.5 References<br />

1. L. Balazs et al., Physica A, 217, 319 (1995).<br />

2. G. S. Frankel, Corros. Sci, 30, 1203-1218 (1990).<br />

358

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