Hardware Interface Description - Wireless Data Modules

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MC55/56 Hardware Interface Description Confidential / Released s 6.2 Mounting MC55/56 onto the application platform There are many ways to properly install MC55/56 in the host device. An efficient approach is to mount the MC55/56 PCB to a frame, plate, rack or chassis. Fasteners can be M1.6 or M1.8 screws plus suitable washers, circuit board spacers, or customized screws, clamps, or brackets. Screws must be inserted with the screw head on the bottom of the MC55/56 PCB. In addition, the board-to-board connection can also be utilized to achieve better support. Particular attention must be paid to the holes marked with an arrow in Figure 42. Both holes are close to other components of MC55/56 and care must be taken to avoid contacting them. For example, you can insert plastic screws and plastic washers, or fasteners small enough not to protrude beyond the mounting areas specified in Figure 41. Figure 42: Mounting holes on MC55/56 For proper grounding it is strongly recommended to use the ground plane on the back side in addition to the five GND pins of the board-to-board connector. To avoid short circuits ensure that the remaining sections of the MC55/56 PCB do not come into contact with the host device since there are a number of test points. Figure 40 shows the positions of all test points. To prevent mechanical damage, be careful not to force, bend or twist the module. Be sure it is positioned flat against the host device. All the information you need to install an antenna is summarized in Chapter 4.1. Note that the antenna pad on the bottom of the MC55/56 PCB must not be influenced by any other PCBs, components or by the housing of the host device. It needs to be surrounded by a restricted space as described in Chapter 4.1. MC55/56_hd_v02.06 Page 96 of 105 29.10.2004
MC55/56 Hardware Interface Description Confidential / Released s 6.3 Board-to-board connector This chapter provides specifications for the 50-pin board-to-board connector which serves as physical interface to the host application. The receptacle assembled on the MC55/56 PCB is type Hirose DF12C. Mating headers from Hirose are available in different stacking heights. Figure 43: Hirose DF12C receptacle on MC55/56 Figure 44: Header Hirose DF12 series Table 35: Ordering information DF12 series Item Part number Stacking height (mm) HRS number Receptacle on MC55/56 DF12C(3.0)-50DS-0.5V(81) 3 - 5 537-0694-9-81 Headers DF12 series DF12E(3.0)-50DP-0.5V(81) DF12E(3.5)-50DP-0.5V(81) DF12E(4.0)-50DP-0.5V(81) DF12E(5.0)-50DP-0.5V(81) 3.0 3.5 4.0 5.0 537-0834-6-** 537-0534-2-** 537-0559-3-** 537-0584-0-** Notes: The headers listed above are without boss and metal fitting. Please contact Hirose for details on other types of mating headers. Asterixed HRS numbers denote different types of packaging. Table 36: Electrical and mechanical characteristics of the Hirose DF12C connector Parameter Specification (50 pin board-to-board connector) Number of contacts 50 Quantity delivered 2000 connectors per tape & reel Voltage 50V Rated current 0.3A max per contact Resistance 0.05 Ohm per contact Dielectric withstanding voltage 500V RMS min Operating temperature -45°C...+125°C Contact material phosphor bronze (surface: gold plated) Insulator material PA , beige natural Stacking height 3.0 mm ; 3.5 mm ; 4.0 mm ; 5.0 mm Insertion force 21.8N Withdrawal force 1 st 10N Withdrawal force 50 th 10N Maximum connection cycles 50 MC55/56_hd_v02.06 Page 97 of 105 29.10.2004
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Hardware Interface Description - Wireless Data Modules

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