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Finite-Element Analysis and Design Centre
The finite element analysis (FEA), also known as the finite element method (FEM), is a numerical method
for the solution of a complex system of partial differential equations subject to prescribed boundary
conditions. The method uses the concept of piecewise polynomial interpolation. In FEM, the solution region
is cut into a finite number of elements, which are then reconnected at nodes as if the latter were ‘drops
of glue’ holding the elements together. In this method, in steps (i) the governing equation for a typical
element is derived; (ii) all the elements in the solution region are assembled; and (iii) the system of equations
is solved. The FEM is capable of handling more complex problem geometries than could be done by the
finite difference method (FDM) since, unlike in FDM, it has the ability to find the values at any point inside
the solution region rather than at any discrete grid point.
By the early 70's, FEM found extensive use in aeronautics, automotive, defence and nuclear industries. With
the phenomenal increase in the computing power, FEM became a tool of incredible precision. Present day
supercomputers are now able to produce accurate results using FEM for all kinds of parameters. Both 2-
D and 3-D types of modelling of a complex system are used for FEM. 2-D modelling yields less accurate
results though it conserves simplicity and allows the analysis to be run on a relatively normal computer
while 3-D modelling yields more accurate results at the cost of the speed of computation and demanding
faster computing facility. Both the types of modelling facilitate the incorporation of a variety of algorithms
that can allow the system to behave linearly or nonlinearly.
FEM software provides a wide range of simulation options for controlling the complexity of both modelling
and analysis of a system. Similarly, the desired level of accuracy required and associated computational
time requirements can be managed simultaneously to address most engineering applications. FEM allows
the entire design to be constructed, refined, and optimized before the design is translated to a product.
Several modern FEM packages like ANSYS Multiphysics include specific components such as thermal,
electrostatic, electromagnetic, fluid, and structural analysis. In a structural simulation, FEM helps in producing
stiffness and strength visualizations and also in minimizing weight, materials, and costs. Some of the other
FEM packages are COSMOS (for mechanical engineering), FLOWTHERM (for fluid dynamics), NASTRAN
(for aerodynamics), ANSOFT-HFSS (for electron-beam-absent (cold) analysis of electromagnetic structures),
ANSYS-MAGIC (particle-in-cell code for electron-beam-wave interaction, for instance, in particle accelerators
and microwave tubes/vacuum electron devices), and so on. Further, the combination with the finite integration
technique also allows the simulation using the other software like CST Microwave Studio. The use of
appropriate FEM software considerably reduces the number of trials of actual fabrication thereby considerably
reducing the cost and time of manufacturing products.
The Finite-Element Analysis and Design Centre of SKFGI is aimed at
w exploiting the strong knowledge base in FEM available at Applied Science Department of SKFGI
w carrying out original research in FEM that can be used to make the existing software more friendly, less
time consuming and more accurate
w involving undergraduate and postgraduate students in taking up projects of practical relevance
w carrying out research programmes in liaison with Centre for Renewable and Non-Conventional Energy
Studies and Research at SKFGI
w carrying out research programmes in liaison with Sir J. C. Bose Creativity Centre of SKFGI
w collaborating with CSIR-CEERI, Pilani under the existing MoU
w collaborating with NB Institute for Rural Technology, Kolkata under the existing MoU
w interacting with DRDO-MTRDC, Bangalore in the area of microwave tubes and
w carrying out sponsored projects in the area of the design and analysis of devices and systems of practical
relevance.
MoU with CSIR-CEERI, Pilani
SKFGI is perhaps the only Institute in this part of the country to have Memorandum of Understanding
(MoU) of its engineering Institution, namely, Sir J. C. Bose School of Engineering, with one of the most
prestigious National laboratories of CSIR, namely, Central Electronics Engineering Research Institute
(CEERI), Pilani (Rajasthan) to “promote academic and research linkage through collaborative academic and
research endeavours for the cause of the advancement of learning.”
Such a ‘landmark’ in establishing an understanding with a Government laboratory has become all the more
important now in that CSIR-CEERI, besides contributing to the progress of the country through R&D, has
now become one of the constituents of the coveted Academy of Scientific and Innovative Research (AcSIR)
of CSIR. This success in establishing the collaboration with a National laboratory has been made possible
by the reputation of our Institute through the contribution of the faculty members of our Institute in
reviewing and steering the progress of the ongoing projects at CSIR-CEERI as well as through the evidence
our Institute has already shown by jointly organising with CSIR-CEERI the National and International
conferences on engineering education, hosted at our Campus.
Both the participating Institutes (SKFGI and CSIR-CEERI) under this MOU have ensured that all activities
within the framework of the understanding are taken up keeping in view the mission and vision of both the
organisations. Thus, through this agreement we have opened a new vista to the students of our Institute,
who now get an opportunity to be trained through the state-of-the-art technology. Both the Institutes have
agreed under the programme to share the expenditure towards the travel and local hospitality involved in
the mutual visits of the concerned personnel encompassing students, teachers, and scientists. The
understanding includes the extension of the infrastructural facilities, the provision of subsistence allowances
to students, and so on. Besides the undergraduate (B. Tech) programme, the postgraduate (M. Tech) and
the doctoral (Ph. D) programmes have also been brought within the purview of the MOU. While the scope
in terms of the areas of collaboration under the MOU has been made wide open, we have identified some
of them as VLSI design, embedded system, image processing, wireless sensor network, process control
instrumentation, communication system for disaster management, optoelectronics, microwave photonics,
RF and microwave MEMS, slow-wave and fast-wave microwave tubes, terahertz devices, electromagnetic
simulation, structural and thermal analysis, and so on.
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