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Test During Burn-in Evolution - BiTS Workshop

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Technology Trends‣ Low geometry‣ High transistor count‣ Integration, system-on-chip, analogbehavior‣ New packages‣ High frequency‣ Low voltage, high power‣ Non-determ<strong>in</strong>istic tim<strong>in</strong>g‣ High IO count‣ Critical reliability‣ Expensive sockets‣ Multi-layer, f<strong>in</strong>e-pitch boards‣ Thermal control‣ High performance electronics‣ Need of qualified eng<strong>in</strong>eer<strong>in</strong>g3/19/2003 Strategic Use of <strong>Burn</strong> In (Tamas Kerekes) 5

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