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Test During Burn-in Evolution - BiTS Workshop

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Conclusions• With the data collected <strong>in</strong> both the Time &Frequency doma<strong>in</strong>s, the flexible electrical<strong>in</strong>terface concept has been proven to beviable for device test<strong>in</strong>g (for SDRAM). Thereis, however, still room for improvements onthe <strong>in</strong>terface between board to board.• The next challenge would be to prove out theFlexi-<strong>in</strong>terface concept for higher speeddevice test<strong>in</strong>gs (DDR II & beyond).

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