Test During Burn-in Evolution - BiTS Workshop

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Interconnect MaterialShin-Etsu Interconnector (SMM)Courtesy of SHIN-ETSU (http://www.shinpoly.com)
Prototype Evaluations DataTime-Domain MeasurementsTDR (Time Domain Reflectometry)measurements were taken tocapture any abnormalities on theimpedance profiles for thecomplete signal path.The impedance dips below50ohms at the portion of the SMMinterconnect. The SMMinterconnect is not impedancecontrol and hence causes someimpedance mismatch (it has acapacitive effect).
Page 1:
Burn-in & TestSocket WorkshopWELCOM
Page 4 and 5:
Full Wafer ContactBurn-In and Test-
Page 6 and 7: Test During Burn-in Evolution• Ba
Page 8 and 9: Value of Offloading Final Test• I
Page 10 and 11: Parallel Test During Burn-inPre Bur
Page 12 and 13: Wafer-Level Burn-In and Test• Ful
Page 14 and 15: Test Evolution - External Test• F
Page 16 and 17: Wafer-Level Burn-in with BIST• Lo
Page 18 and 19: Wafer-Level Logic Test, BISTLoadAli
Page 20 and 21: Strategic Use of Burn In2003 Burn-i
Page 22 and 23: Pressure on the Burn-In
Page 24 and 25: Technology Trends‣ Low geometry
Page 26 and 27: Dilemmacostvalue?1 + 1 + 1 = 1Scree
Page 28 and 29: Increasing the Value of Burn-In
Page 30 and 31: Possible Added Values Yield increas
Page 32 and 33: Yield Increase During ramp-up (time
Page 34 and 35: Area Management Statistical Process
Page 36 and 37: Key Factors Equipment Data manageme
Page 38 and 39: Flexible Device ManagementuCPSPOWER
Page 40 and 41: Example: Distribution400.000350.000
Page 42 and 43: Development ToolsSPECIFICATIONSAPPL
Page 44 and 45: TeamworkDesignerProcess EngineerTes
Page 46 and 47: Case Study 1:High Coverage Qualific
Page 48 and 49: Case Study 3:TDBI on Embedded NVM E
Page 50 and 51: thank youfor your time andconsidera
Page 52 and 53: Agenda• Background• Objectives
Page 54 and 55: Objectives• To have better toolin
Page 58 and 59: Prototype Evaluations DataTime-Doma
Page 60 and 61: Prototype Evaluations DataFrequency
Page 62 and 63: Prototype Evaluations DataA short p
Page 64: Conclusions• With the data collec
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