Search options available in STN databases - FIZ Karlsruhe
Search options available in STN databases - FIZ Karlsruhe
Search options available in STN databases - FIZ Karlsruhe
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32 Family search example<br />
32.1 Example 1<br />
256<br />
Guide to <strong>STN</strong> Patent Databases<br />
For the US patent numbered 6,300,146 equivalent applications <strong>in</strong> other countries or additional US patents are<br />
sought.<br />
32.1.1 <strong>Search</strong> <strong>in</strong> INPAFAMDB<br />
=> FIL INPAFAMDB<br />
FILE 'INPAFAMDB' ENTERED<br />
COPYRIGHT (C) 2008 European Patent Office / <strong>FIZ</strong> <strong>Karlsruhe</strong><br />
=> S US 6300146/PN<br />
L1 1 US 6300146 /PN<br />
(US6300146/PN)<br />
=> D<br />
BRIEF is the default format. This format provides a good<br />
overview of the whole patent family.<br />
L1 ANSWER 1 OF 1 INPAFAMDB COPYRIGHT 2008 EPO/<strong>FIZ</strong> KA on <strong>STN</strong><br />
AN 15190523 INPAFAMDB<br />
TI Halbleiterbauteil sowie Verfahren zur Messung se<strong>in</strong>er Temperatur.<br />
- HYBRID PACKAGE INCLUDING POWER MOSFET DIE AND CONTROL AND PROTECTION<br />
CIRCUIT DIE WITH SMALLER SENSE MOSFET.<br />
- Hybrid package <strong>in</strong>clud<strong>in</strong>g a power MOSFET die and a control and protection<br />
circuit die with a smaller sense MOSFET.<br />
- Ioniz<strong>in</strong>g bar and method of its fabrication.<br />
INS THIERRY VINCENT, FR<br />
- THIERRY VINCENT<br />
PAS INT RECTIFIER CORP, US<br />
- INT RECTIFIER CORP<br />
IPCR H01L0023-34 [I,A ]; H03K0017-08 [N,A ]; H03K0017-082 [I,A ];<br />
H01L0023-34 [I,C*]; H03K0017-08 [N,C*]; H03K0017-082 [I,C*]<br />
EPC H03K0017-082B<br />
AB (US 6137165 A)<br />
A power MOSFET die and a logic and protection circuit die are mounted on<br />
a common lead frame pad, such as a TO220 lead frame pad. The logic and<br />
protection circuit die <strong>in</strong>cludes a MOSFET that is connected <strong>in</strong> parallel<br />
with the power MOSFET but which is smaller than the power MOSFET and<br />
which dissipates power at a predeterm<strong>in</strong>ed fraction of that of the power<br />
MOSFET. The logic and protection circuit die also <strong>in</strong>cludes a temperature<br />
sensor that is <strong>in</strong> close proximity to the MOSFET and determ<strong>in</strong>es the<br />
temperature of the MOSFET. The die also <strong>in</strong>cludes another temperature<br />
sensor that is located distant from the MOSFET to determ<strong>in</strong>e the<br />
temperature of the lead frame. The temperature of the power MOSFET can be<br />
determ<strong>in</strong>ed from the temperature measured by these two sensors and from<br />
the ratio of the power dissipated by the two MOSFETs.<br />
PATENT FAMILY INFORMATION INPAFAMDB<br />
+-------- PUBLICATIONS --------+ +-------- APPLICATIONS --------+<br />
DE 10031115 A1 20010125 DE 2000-10031115 A 20000626<br />
JP 2001015655 A 20010119 JP 2000-189210 A 20000623<br />
US 6137165 A 20001024 US 1999-344704 A 19990625<br />
US 6300146 B1 20011009 US 2000-549280 A 20000414<br />
+--------- PRIORITIES ---------+<br />
US 1999-344704 A 19990625<br />
US 2000-549280 A 20000414<br />
32.1.2 <strong>Search</strong> <strong>in</strong> INPADOCDB<br />
=> FIL INPADOCDB