CHEM02200704003 Nilamadhab Pandhy - Homi Bhabha National ...
CHEM02200704003 Nilamadhab Pandhy - Homi Bhabha National ...
CHEM02200704003 Nilamadhab Pandhy - Homi Bhabha National ...
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Chapter 5<br />
boundaries and kinks where passive film formation is highly unstable. However, the degree of<br />
ammonium ion formation increases with increase in amount of nitrogen, and decreases with<br />
applied potential [168]. To compensate the decreasing<br />
amount of ammonium ions at higher<br />
potential Kamachi Mudali et al proposed the subsequent formation of nitrates and nitrites ions<br />
from ammonium ion, which are well known for their strong stabilizing effect on passive film<br />
stability [169]. Similarly, it has also been observed the nitrogen implantation decreases the passive<br />
current density as well as corrosion current density owing to enrichment of nitrogen beneath the<br />
passive film, and segregation of nitrogen during polarization forming interstitial nitrides which<br />
decreases the surface dissolution process. Abundant evidence for the existence of nitrogen beneath<br />
the passive film subsist from surface analytical technique, and the decrease in passivation current<br />
is because of charge associated with passive film formation is reduced by implanted nitrogen<br />
[168]. Thus, less current is required for passive film growth with increase in nitrogen implantation<br />
dose. The decrease in corrosion current density can also be attributed to surface segregation of<br />
nitrogen to the oxide-metal interfaceduring anodic polarization forming stable interstitial nitride<br />
phases of chromium [163, 166, 170, 171]. The formation of chromium nitride during polarization<br />
has been confirmed by several studies, and has been argued on the basis of low solubility of<br />
nitrogen in austenitic stainless steel, and thermodynamically favourable process of formation.<br />
These phases are proposed [166] to act as a kinetic barrier to the dissolution of the alloy because<br />
their dissolution reaction is slow due to multi-electron transfer process.<br />
5.2. 8 Electrochemical impedance measurement<br />
The electrochemical impedance measurements for both prior to, and after implantation<br />
with different doses of nitrogen in open circuit potential condition are presented in Fig. 5.8. All the<br />
Nyquist plots showed unfinished semi-circular arc and appropriate equivalent circuit is chosen as<br />
shown in Fig. 3.9 to evaluate the obtained experimental results. The fitted parameters for double