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Wüest M. 51 Wykes M. 82 Yamaguchi M. 17 Ybarra G. 129 Yubero F ...

Wüest M. 51 Wykes M. 82 Yamaguchi M. 17 Ybarra G. 129 Yubero F ...

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JUNE 26 MONDAY AFTERNOON<br />

RIVA-TF-MoA-OR.16 DUAL DC MAGNETRON CATHODE CO DEPOSITION OF (Al,<br />

Ti) AND [(Al, Ti) N] THIN FILMS WITH CONTROLLED DEPTH COMPOSITION. Y.<br />

Nunes, A. Wemans, H. P. Marques, Q. Ferreira, O. M. N. Todoro and M. J. P. Maneira. Cefitec -<br />

Department of Physics, Faculty of Sciences and Technology, New University of Lisbon, P-2<strong>82</strong>9-<br />

<strong>51</strong>6, Caparica, PORTUGAL.<br />

Recent publications show that [(Ti, Al) N] thin films produced with direct current reactive magnetron<br />

sputtering can significantly improve electrochemical and biocompatibility properties of the base<br />

metal alloy. The purpose of this work is to study the characteristics of titanium-aluminium nitride<br />

[(Ti, Al) N] films produced using a novel coating technique.<br />

Thin (Al, Ti) films with a linear gradient depth composition are obtained from a custom made codeposition<br />

system which employs pure Al and Ti sputter targets. Two direct current magnetron cathodes<br />

with independent plasma sources are simultaneous controlled by custom LabView software<br />

which allows real-time and independent control of the deposition parameters for both cathodes.<br />

Two types of gradient thin films were produced. Starting with 100% Al at bottom and 100% Ti at<br />

surface and starting 100% Ti and ending with 100% Al at surface. Both types of films are of 500nm<br />

thin. Depth profile was acquired using secondary ion mass spectrometry (SIMS). These films of (Ti,<br />

Al) and [(Ti, Al) N], have been grown onto Mg, Glass and Si (100) substrates, the first in argon atmosphere<br />

and the later in nitrogen.<br />

Further analysis will be carried using atomic force microscopy to investigate the surface morphology<br />

and X-ray photoelectron spectroscopy (XPS) in order to detect possible chemical interactions between<br />

the film compounds.<br />

48

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