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Abstract<br />

In the field of a reliability study on power e<strong>le</strong>ctronic components dedicated to e<strong>le</strong>ctrical<br />

traction, the identification then <strong>est</strong>imation of the thermal constraints generated during<br />

operation are very important. Indeed, with their repetition over the time, they induce a thermal<br />

fatigue, which consequence is the material damage of the component. This phenomenon <strong>le</strong>ads<br />

to an evolution of the e<strong>le</strong>ctrical and thermal characteristics of the power modu<strong>le</strong>s and appear<br />

as one of the major causes of failure listed for e<strong>le</strong>ctrical traction where thermal cycling<br />

constraints are severe.<br />

After done astate of the art of the components used in the e<strong>le</strong>ctrical traction and formulate the<br />

theoretical basis required for the comprehension and the resolution of the prob<strong>le</strong>matic, we<br />

focused to <strong>est</strong>imate the lGBT power modu<strong>le</strong> lifetime used in an automotive hybrid vehic<strong>le</strong>.<br />

Thus, after a recording, with an original method with optical fibres, the chips temperature on a<br />

vehic<strong>le</strong> in operation in an urban traffic, then an identification of thermal cyc<strong>le</strong>s with a<br />

statistical method of the temperature distribution, we have done sorne power cycling t<strong>est</strong>s<br />

with the intention of <strong>est</strong>imate the modu<strong>le</strong> lifetime under different constraint <strong>le</strong>vels. Finally,<br />

with a correlation ofthese two t<strong>est</strong>s, we've been ab<strong>le</strong> to <strong>est</strong>imate the strong presented by these<br />

modu<strong>le</strong>s versus the repetitive of the thermal constraints generated and reinforce the<br />

automotive manufacturers in their requ<strong>est</strong> of the lifetime.<br />

Finally, we have focused on the <strong>est</strong>imation of the thermal constraints generated, first, in<br />

DUAL modu<strong>le</strong>, with an unidimensional Re mode!. Then, with the use of a model taking into<br />

account the thermal interactions between chips, we have looked the case of the multichip<br />

integrated converters. In this last study, the model has been validated experimentally on a<br />

hybrid traction line and allows us to obtain thermal constraints generated in real operation<br />

conditions on a normalised European road mission profi<strong>le</strong>. Finally, with this study, we have<br />

shown the possibilities of this tool in the supervision and prediction of the thermal constraints<br />

during operation of the integrated power converters.

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