datasheet (3).pdf - EEWeb

More documents

Recommendations

Info

dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 31-6: TIMERQ (QEI MODULE) EXTERNAL CLOCK TIMING CHARACTERISTICS QEB POSCNT TQ10 TQ15 DS70291E-page 362 © 2011 Microchip Technology Inc. TQ11 TABLE 31-25: QEI MODULE EXTERNAL CLOCK TIMING REQUIREMENTS AC CHARACTERISTICS Param No. TQ10 TtQH TQCK High Time Synchronous, with prescaler TQ11 TtQL TQCK Low Time Synchronous, with prescaler TQ20 Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Symbol Characteristic (1) Min Typ Max Units Conditions TQ15 TtQP TQCP Input Period Synchronous, with prescaler TCY + 20 — ns Must also meet parameter TQ15 TCY + 20 — ns Must also meet parameter TQ15 2 * TCY + 40 — ns — TQ20 TCKEXTMRL Delay from External TxCK Clock Edge to Timer Increment 0.5 TCY 1.5 TCY — — Note 1: These parameters are characterized but not tested in manufacturing.
dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 31-7: INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS ICx IC10 IC11 TABLE 31-26: INPUT CAPTURE TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V AC CHARACTERISTICS (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Param No. Symbol Characteristic (1) Min Max Units Conditions IC10 TccL ICx Input Low Time No Prescaler 0.5 TCY + 20 — ns With Prescaler 10 — ns IC11 TccH ICx Input High Time No Prescaler 0.5 TCY + 20 — ns With Prescaler 10 — ns IC15 TccP ICx Input Period (TCY + 40)/N — ns N = prescale value (1, 4, 16) Note 1: These parameters are characterized but not tested in manufacturing. FIGURE 31-8: OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS TABLE 31-27: OUTPUT COMPARE MODULE TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V AC CHARACTERISTICS (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Param No. Symbol Characteristic (1) Min Typ Max Units Conditions OC10 TccF OCx Output Fall Time — — — ns See parameter D032 OC11 TccR OCx Output Rise Time — — — ns See parameter D031 Note 1: These parameters are characterized but not tested in manufacturing. © 2011 Microchip Technology Inc. DS70291E-page 363 IC15 Note: Refer to Figure 31-1 for load conditions. OCx (Output Compare or PWM Mode) OC11 OC10 Note: Refer to Figure 31-1 for load conditions.
Page 1 and 2:
dsPIC33FJ32MC302/304, dsPIC33FJ64MC
Page 3 and 4:
Page 5 and 6:
Page 7 and 8:
Page 9 and 10:
Page 11 and 12:
Page 13 and 14:
Page 15 and 16:
Page 17 and 18:
Page 19 and 20:
Page 21 and 22:
Page 23 and 24:
Page 25 and 26:
Page 27 and 28:
Page 29 and 30:
Page 31 and 32:
Page 33 and 34:
Page 35 and 36:
Page 37 and 38:
Page 39 and 40:
Page 41 and 42:
Page 43 and 44:
Page 45 and 46:
Page 47 and 48:
© 2011 Microchip Technology Inc. D
Page 49 and 50:
Page 51 and 52:
Page 53 and 54:
Page 55 and 56:
Page 57 and 58:
Page 59 and 60:
Page 61 and 62:
Page 63 and 64:
Page 65 and 66:
Page 67 and 68:
Page 69 and 70:
Page 71 and 72:
Page 73 and 74:
Page 75 and 76:
Page 77 and 78:
Page 79 and 80:
Page 81 and 82:
Page 83 and 84:
Page 85 and 86:
Page 87 and 88:
Page 89 and 90:
Page 91 and 92:
Page 93 and 94:
Page 95 and 96:
Page 97 and 98:
Page 99 and 100:
Page 101 and 102:
Page 103 and 104:
Page 105 and 106:
Page 107 and 108:
Page 109 and 110:
Page 111 and 112:
Page 113 and 114:
Page 115 and 116:
Page 117 and 118:
Page 119 and 120:
Page 121 and 122:
Page 123 and 124:
Page 125 and 126:
Page 127 and 128:
Page 129 and 130:
Page 131 and 132:
Page 133 and 134:
Page 135 and 136:
Page 137 and 138:
Page 139 and 140:
Page 141 and 142:
Page 143 and 144:
Page 145 and 146:
Page 147 and 148:
Page 149 and 150:
Page 151 and 152:
Page 153 and 154:
Page 155 and 156:
Page 157 and 158:
Page 159 and 160:
Page 161 and 162:
Page 163 and 164:
Page 165 and 166:
Page 167 and 168:
Page 169 and 170:
Page 171 and 172:
Page 173 and 174:
Page 175 and 176:
Page 177 and 178:
Page 179 and 180:
Page 181 and 182:
Page 183 and 184:
Page 185 and 186:
Page 187 and 188:
Page 189 and 190:
Page 191 and 192:
Page 193 and 194:
Page 195 and 196:
Page 197 and 198:
Page 199 and 200:
Page 201 and 202:
Page 203 and 204:
Page 205 and 206:
Page 207 and 208:
Page 209 and 210:
Page 211 and 212:
Page 213 and 214:
Page 215 and 216:
Page 217 and 218:
Page 219 and 220:
Page 221 and 222:
Page 223 and 224:
Page 225 and 226:
Page 227 and 228:
Page 229 and 230:
Page 231 and 232:
Page 233 and 234:
Page 235 and 236:
Page 237 and 238:
Page 239 and 240:
Page 241 and 242:
Page 243 and 244:
Page 245 and 246:
Page 247 and 248:
Page 249 and 250:
Page 251 and 252:
Page 253 and 254:
Page 255 and 256:
Page 257 and 258:
Page 259 and 260:
Page 261 and 262:
Page 263 and 264:
Page 265 and 266:
Page 267 and 268:
Page 269 and 270:
Page 271 and 272:
Page 273 and 274:
Page 275 and 276:
Page 277 and 278:
Page 279 and 280:
Page 281 and 282:
Page 283 and 284:
Page 285 and 286:
Page 287 and 288:
Page 289 and 290:
Page 291 and 292:
Page 293 and 294:
Page 295 and 296:
Page 297 and 298:
Page 299 and 300:
Page 301 and 302:
Page 303 and 304:
Page 305 and 306:
Page 307 and 308:
Page 309 and 310:
Page 311 and 312: dsPIC33FJ32MC302/304, dsPIC33FJ64MC
Page 329 and 330: © 2011 Microchip Technology Inc. D
Page 361: dsPIC33FJ32MC302/304, dsPIC33FJ64MC
Page 413 and 414:
Page 415 and 416:
Page 417 and 418:
Page 419 and 420:
Page 421 and 422:
Page 423 and 424:
Page 425 and 426:
Page 427 and 428:
Page 429 and 430:
Page 431 and 432:
Page 433 and 434:
Page 435 and 436:
show all

datasheet (3).pdf - EEWeb

Create successful ePaper yourself

Delete template?

Save as template?