datasheet (3).pdf - EEWeb

dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04
TABLE 32-5: DC CHARACTERISTICS: DOZE CURRENT (IDOZE)
DC CHARACTERISTICS
Parameter
No.
Typical (1)
Max
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +150°C for High Temperature
Doze
Ratio
HDC72a 39 45 1:2 mA
Units Conditions
HDC72f 18 25 1:64 mA +150°C 3.3V 20 MIPS
HDC72g 18 25 1:128 mA
Note 1: Parameters with Doze ratios of 1:2 and 1:64 are characterized, but are not tested in manufacturing.
TABLE 32-6: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS
DC CHARACTERISTICS
Param
No.
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +150°C for High Temperature
Symbol Characteristic Min Typ Max Units Conditions
VOL Output Low Voltage
HDO10 I/O ports — — 0.4 V IOL = 1 mA, VDD = 3.3V
HDO16 OSC2/CLKO — — 0.4 V IOL = 1 mA, VDD = 3.3V
VOH Output High Voltage
HDO20 I/O ports 2.40 — — V IOH = -1 mA, VDD = 3.3V
HDO26 OSC2/CLKO 2.41 — — V IOH = -1 mA, VDD = 3.3V
TABLE 32-7: DC CHARACTERISTICS: PROGRAM MEMORY
Standard Operating Conditions: 3.0V to 3.6V
DC CHARACTERISTICS
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +150°C for High Temperature
Param
No.
Symbol Characteristic (1) Program Flash Memory
Min Typ Max Units Conditions
HD130 EP Cell Endurance 10,000 — — E/W -40°C to +150°C (2)
HD134 TRETD Characteristic Retention 20 — — Year 1000 E/W cycles or less and no
other specifications are violated
Note 1: These parameters are assured by design, but are not characterized or tested in manufacturing.
2: Programming of the Flash memory is not allowed above 125°C.
© 2011 Microchip Technology Inc. DS70291E-page 399