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Table 2.1. (Continued )<br />

Development 2012–2015 2016–2020 Beyond 2020<br />

Material Technology<br />

Interoperability<br />

• Virtualization and anonymisation<br />

• Scalable PKI based on hierarchical<br />

and Cross certification approaches<br />

• Lightweight key management for<br />

establishing trust relationships<br />

• Privacy by Design techniques,<br />

including data minimisation,<br />

identification, authentication and<br />

anonymisation<br />

• SiC, GaN<br />

• Silicon<br />

• Improved/new semiconductor manufacturing<br />

processes/technologies<br />

for higher temperature ranges<br />

• Use of mix of pragmatic empiric<br />

approach and advanced interoperability<br />

approaches<br />

• Cost of interoperability still high<br />

• Some certification programmes in<br />

place<br />

• Privacy needs automatic evaluation<br />

• Context centric security<br />

• Homomorphic Encryption<br />

• Searchable Encryption<br />

• Protection mechanisms for IoT<br />

DoS/DdoS attacks<br />

• Diamond<br />

• Optimized and market proof interoperability<br />

approaches used<br />

• Interoperability under stress as market<br />

grows<br />

• Cost of interoperability reduced<br />

• Several successful certification programmes<br />

in place<br />

• Graphen<br />

• Automated self-adaptable and agile<br />

interoperability<br />

130 Internet of Things Strategic Research and Innovation Agenda<br />

Standardisation<br />

• IoT standardisation<br />

• M2M standardisation<br />

• Interoperability profiles<br />

• Application independent sensor and<br />

actuator semantics and profiles<br />

• Standards for cross interoperability<br />

with heterogeneous networks<br />

• IoT data and information sharing<br />

• Standards for autonomic communication<br />

protocols

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