uPD789074 Subseries 8-Bit Single-Chip Microcontrollers UD - Home

More documents

Recommendations

Info

CHAPTER 17 PACKAGE DRAWING30-PIN PLASTIC SSOP (7.62 mm (300))30 16detail of lead endFGT1 15AEPLUHIJSCNSBDMMKNOTEEach lead centerline is located within 0.13 mm ofits true position (T.P.) at maximum material condition.ITEMABCDEFGHIJKLMNPTUMILLIMETERS9.85±0.150.45 MAX.0.65 (T.P.)0.24+0.08−0.070.1±0.051.3±0.11.28.1±0.26.1±0.21.0±0.20.17±0.030.50.130.103° +5°−3°0.250.6±0.15S30MC-65-5A4-2222User’s Manual U14801EJ3V1<strong>UD</strong>
CHAPTER 18 RECOMMENDED SOLDERING CONDITIONSThe µPD789071, 789072, and 789074 should be soldered and mounted under the following recommendedconditions.For soldering methods and conditions other than those recommended below, contact an NEC Electronics salesrepresentative.For technical information, see the following website.Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)Table 18-1. Surface Mounting Type Soldering Conditions (1/2)µPD789071MC-×××-5A4: 30-pin plastic SSOP (7.62 mm (300))µPD789072MC-×××-5A4: 30-pin plastic SSOP (7.62 mm (300))µPD789074MC-×××-5A4: 30-pin plastic SSOP (7.62 mm (300))µPD789071MC(A)-×××-5A4: 30-pin plastic SSOP (7.62 mm (300))µPD789072MC(A)-×××-5A4: 30-pin plastic SSOP (7.62 mm (300))µPD789074MC(A)-×××-5A4: 30-pin plastic SSOP (7.62 mm (300))Soldering Method Soldering Conditions Recommended ConditionSymbolInfrared reflowVPSWave solderingPackage peak temperature: 235°C, Time: 30 seconds max.(at 210°C or higher), Count: Three times or lessPackage peak temperature: 215°C, Time: 40 seconds max.(at 200°C or higher), Count: Three times or lessSolder bath temperature: 260°C max., Time: 10 seconds max., Count:Once, Preheating temperature: 120°C max. (package surfacetemperature)IR35-00-3VP15-00-3WS60-00-1Partial heating Pin temperature: 350°C max., Time: 3 seconds max. (per pin row) −µPD78F9076MC-5A4: 30-pin plastic SSOP (7.62 mm (300))Soldering Method Soldering Conditions RecommendedCondition SymbolInfrared reflowVPSWave solderingPackage peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),Count: Three times or less, Exposure limit: 7 days Note(after that, prebaking is necessary at 125°C for 10 hours)Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),Count: Three times or less, Exposure limit: 7 days Note(after that, prebaking is necessary at 125°C for 10 hours)Solder bath temperature: 260°C max. , Time: 10 seconds max.,Count: OncePreheating temperature: 120°C max. (package surface temperature), Exposurelimit: 7 days Note (after that, prebake at 125°C for 10 hours)IR35-107-3VP15-107-3WS60-107-1Partial heating Pin temperature: 350°C max., Time: 3 seconds max. (per pin row) –Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.Caution Do not use different soldering methods together (except for partial heating).User’s Manual U14801EJ3V1<strong>UD</strong> 223
Page 1 and 2:
User’s ManualµPD789074 Subseries
Page 3 and 4:
NOTES FOR CMOS DEVICES1VOLTAGE APPL
Page 5 and 6:
Regional InformationSome informatio
Page 7 and 8:
INTRODUCTIONReadersPurposeOrganizat
Page 9:
Documents for Flash Memory WritingP
Page 13 and 14:
CHAPTER 11 STANDBY FUNCTION .......
Page 15 and 16:
LIST OF FIGURES (1/3)Figure No. Tit
Page 17 and 18:
LIST OF FIGURES (3/3)Figure No. Tit
Page 19 and 20:
LIST OF TABLES (2/2)Table No. Title
Page 21 and 22:
CHAPTER 1 GENERAL1.2 Features• RO
Page 23 and 24:
CHAPTER 1 GENERAL1.6 Pin Configurat
Page 25 and 26:
CHAPTER 1 GENERALThe major function
Page 27 and 28:
CHAPTER 1 GENERAL1.8 Block DiagramT
Page 29 and 30:
CHAPTER 1 GENERAL1.10 Differences B
Page 31 and 32:
CHAPTER 2 PIN FUNCTIONS(2) Non-port
Page 33 and 34:
CHAPTER 2 PIN FUNCTIONS(h) RxD20, T
Page 35 and 36:
CHAPTER 2 PIN FUNCTIONS2.3 Pin I/O
Page 37 and 38:
CHAPTER 3 CPU ARCHITECTURE3.1 Memor
Page 39 and 40:
CHAPTER 3 CPU ARCHITECTUREFigure 3-
Page 41 and 42:
CHAPTER 3 CPU ARCHITECTURE3.1.1 Int
Page 43 and 44:
Page 45 and 46:
Page 47 and 48:
CHAPTER 3 CPU ARCHITECTURE(a) Inter
Page 49 and 50:
CHAPTER 3 CPU ARCHITECTURE3.2.2 Gen
Page 51 and 52:
CHAPTER 3 CPU ARCHITECTURETable 3-3
Page 53 and 54:
CHAPTER 3 CPU ARCHITECTURE3.3 Instr
Page 55 and 56:
CHAPTER 3 CPU ARCHITECTURE3.3.3 Tab
Page 57 and 58:
CHAPTER 3 CPU ARCHITECTURE3.4.2 Sho
Page 59 and 60:
CHAPTER 3 CPU ARCHITECTURE3.4.4 Reg
Page 61 and 62:
CHAPTER 3 CPU ARCHITECTURE3.4.6 Bas
Page 63 and 64:
CHAPTER 4 PORT FUNCTIONSTable 4-1.
Page 65 and 66:
CHAPTER 4 PORT FUNCTIONS4.2.2 Port
Page 67 and 68:
CHAPTER 4 PORT FUNCTIONSFigure 4-5.
Page 69 and 70:
CHAPTER 4 PORT FUNCTIONSFigure 4-7.
Page 71 and 72:
CHAPTER 4 PORT FUNCTIONS4.3 Port Fu
Page 73 and 74:
CHAPTER 4 PORT FUNCTIONS(3) Pull-up
Page 75 and 76:
CHAPTER 5 CLOCK GENERATOR5.1 Clock
Page 77 and 78:
CHAPTER 5 CLOCK GENERATOR5.4 System
Page 79 and 80:
CHAPTER 5 CLOCK GENERATORFigure 5-4
Page 81 and 82:
CHAPTER 5 CLOCK GENERATOR5.6 Changi
Page 83 and 84:
Figure 6-1. Block Diagram of 16-Bit
Page 85 and 86:
CHAPTER 6 16-BIT TIMER 906.3 Contro
Page 87 and 88:
CHAPTER 6 16-BIT TIMER 90(2) Buzzer
Page 89 and 90:
CHAPTER 6 16-BIT TIMER 906.4 Operat
Page 91 and 92:
CHAPTER 6 16-BIT TIMER 906.4.2 Oper
Page 93 and 94:
CHAPTER 6 16-BIT TIMER 906.4.4 16-b
Page 95 and 96:
CHAPTER 6 16-BIT TIMER 906.5 Notes
Page 97 and 98:
CHAPTER 7 8-BIT TIMER/EVENT COUNTER
Page 99 and 100:
Page 101 and 102:
Page 103 and 104:
Page 105 and 106:
Page 107 and 108:
Page 109 and 110:
CHAPTER 8 WATCHDOG TIMER8.1 Watchdo
Page 111 and 112:
Page 113 and 114:
Page 115 and 116:
CHAPTER 9 SERIAL INTERFACE 209.1 Fu
Page 117 and 118:
Figure 9-2. Block Diagram of Baud R
Page 119 and 120:
CHAPTER 9 SERIAL INTERFACE 209.3 Co
Page 121 and 122:
CHAPTER 9 SERIAL INTERFACE 20(1) Op
Page 123 and 124:
CHAPTER 9 SERIAL INTERFACE 20(4) Ba
Page 125 and 126:
CHAPTER 9 SERIAL INTERFACE 20(b) Ge
Page 127 and 128:
CHAPTER 9 SERIAL INTERFACE 209.4.2
Page 129 and 130:
CHAPTER 9 SERIAL INTERFACE 20(b) As
Page 131 and 132:
CHAPTER 9 SERIAL INTERFACE 20(d) Ba
Page 133 and 134:
CHAPTER 9 SERIAL INTERFACE 20(2) Co
Page 135 and 136:
CHAPTER 9 SERIAL INTERFACE 20(c) Tr
Page 137 and 138:
CHAPTER 9 SERIAL INTERFACE 20(e) Re
Page 139 and 140:
CHAPTER 9 SERIAL INTERFACE 20(3) Ca
Page 141 and 142:
CHAPTER 9 SERIAL INTERFACE 20(b) As
Page 143 and 144:
CHAPTER 9 SERIAL INTERFACE 20(2) Co
Page 145 and 146:
CHAPTER 9 SERIAL INTERFACE 20Figure
Page 147 and 148:
Page 149 and 150:
Page 151 and 152:
CHAPTER 10 INTERRUPT FUNCTIONSTable
Page 153 and 154:
CHAPTER 10 INTERRUPT FUNCTIONS10.3
Page 155 and 156:
CHAPTER 10 INTERRUPT FUNCTIONS(2) I
Page 157 and 158:
CHAPTER 10 INTERRUPT FUNCTIONS(4) P
Page 159 and 160:
CHAPTER 10 INTERRUPT FUNCTIONSFigur
Page 161 and 162:
Page 163 and 164:
Page 165 and 166:
CHAPTER 11 STANDBY FUNCTION11.1 Sta
Page 167 and 168:
CHAPTER 11 STANDBY FUNCTION11.2 Ope
Page 169 and 170:
CHAPTER 11 STANDBY FUNCTION11.2.2 S
Page 171 and 172: CHAPTER 12 RESET FUNCTIONThe follow
Page 173 and 174: CHAPTER 12 RESET FUNCTIONTable 12-1
Page 175 and 176: CHAPTER 13 µPD78F907613.1 Flash Me
Page 177 and 178: CHAPTER 13 µPD78F9076Figure 13-3.
Page 179 and 180: CHAPTER 13 µPD78F907613.1.3 On-boa
Page 181 and 182: CHAPTER 13 µPD78F9076When the rese
Page 183 and 184: CHAPTER 13 µPD78F9076Figure 13-9.
Page 185 and 186: CHAPTER 14 INSTRUCTION SET OVERVIEW
Page 195 and 196: CHAPTER 15 ELECTRICAL SPECIFICATION
Page 221: CHAPTER 16 ELECTRICAL SPECIFICATION
Page 225 and 226: APPENDIX A DEVELOPMENT TOOLSThe fol
Page 227 and 228: APPENDIX A DEVELOPMENT TOOLSA.1 Sof
Page 229 and 230: APPENDIX A DEVELOPMENT TOOLSA.4 Fla
Page 231 and 232: APPENDIX B NOTES ON TARGET SYSTEM D
Page 233 and 234: APPENDIX C REGISTER INDEXC.1 Regist
Page 235 and 236: APPENDIX C REGISTER INDEXC.2 Regist
Page 237 and 238: APPENDIX D REVISION HISTORYThe foll
show all

uPD789074 Subseries 8-Bit Single-Chip Microcontrollers UD - Home

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?