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uPD789074 Subseries 8-Bit Single-Chip Microcontrollers UD - Home

uPD789074 Subseries 8-Bit Single-Chip Microcontrollers UD - Home

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CHAPTER 18 RECOMMENDED SOLDERING CONDITIONSTable 18-1. Surface Mounting Type Soldering Conditions (2/2)µPD789071MC-×××-5A4-A: 30-pin plastic SSOP (7.62 mm (300))µPD789072MC-×××-5A4-A: 30-pin plastic SSOP (7.62 mm (300))µPD789074MC-×××-5A4-A: 30-pin plastic SSOP (7.62 mm (300))µPD78F9076MC-5A4-A: 30-pin plastic SSOP (7.62 mm (300))Soldering Method Soldering Conditions Recommended ConditionSymbolInfrared reflowPackage peak temperature: 260°C, Time: 60 seconds max. (at 220°C orhigher), Count: Three times or less, Exposure limit: 7 days Note (after that,prebake at 125°C for 20 to 72 hours)IR60-207-3Wave soldering For details, contact an NEC Electronics sales representative. −Partial heating Pin temperature: 350°C max., Time: 3 seconds max. (per pin row) −Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.Caution Do not use different soldering methods together (except for partial heating).RemarkProducts that have the part numbers suffixed by "-A" are lead-free products.224User’s Manual U14801EJ3V1<strong>UD</strong>

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