ARCHIVE 2009 - BiTS Workshop

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2009Session 3Adventures in Test & Burn-in OperationsAcknowledgements• Nick DeJesu – TI Software Development Manager• Glenn Lorig – TI DSP Systems PE Manager• Gary Dirige – TIPI Product Engineering Manager3/2009 CID: A New Breakthrough Solution for Contactor Hardware Tracking 19Paper #2March 8 - 11, 200910
2009Session 3Adventures in Test & Burn-in OperationsMechanical Reliability Testas Part of Final Test of aPackaged ChipC-Y Li, T Wooden, SM Low, TM KorhonenChe-Yu Li and Co, Ithaca, NYProtos Electronics, Santa Clara, CAADE Technologies, Singapore2009 BiTS WorkshopMarch 8 - 11, 2009Background• Final test of packaged chip typically includeselectrical and burn-in test emphasizing electricalperformance• Mechanical reliability test is typically not done• Mechanical test would identify manufacturing anddesign defects that can cause early mechanicalfailures in service• Omitting mechanical testing can become costly ifdefective chips are shipped to customer3/2009 Mechanical Reliability Test as Part of Final Test of a Packaged Chip 2Paper #3March 8 - 11, 20091
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ARCHIVE 2009 - BiTS Workshop

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