ARCHIVE 2009 - BiTS Workshop

2009Session 3Adventures in Test & Burn-in OperationsBurn-in OvenBurn-in ovens, boards and sockets haveconstraints:• Thermal budget> Finite cooling capability per DUT• Power budget> Only so many power supplies and amps per boardProblem!These constraints limit how many units can beloaded at a time3/2009 Substrate Bias: Application in Final Test and Burn-in of High-Power CPU’s 3How to Increase Throughput?• Reduce DUT power by lowering Vdd, Temp orboth> Possible with extended duration (and lots ofreliability modeling)> Usually economically impractical• Apply transistor substrate bias> Reduce DUT power without changes to Vdd andtemperature setpointsWhat’s substrate bias?3/2009 Substrate Bias: Application in Final Test and Burn-in of High-Power CPU’s 4Paper #4March 8 - 11, 20092