ARCHIVE 2009 - BiTS Workshop
ARCHIVE 2009 - BiTS Workshop
ARCHIVE 2009 - BiTS Workshop
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<strong>2009</strong>Session 3Adventures in Test & Burn-in OperationsMechanical Reliability Testas Part of Final Test of aPackaged ChipC-Y Li, T Wooden, SM Low, TM KorhonenChe-Yu Li and Co, Ithaca, NYProtos Electronics, Santa Clara, CAADE Technologies, Singapore<strong>2009</strong> <strong>BiTS</strong> <strong>Workshop</strong>March 8 - 11, <strong>2009</strong>Background• Final test of packaged chip typically includeselectrical and burn-in test emphasizing electricalperformance• Mechanical reliability test is typically not done• Mechanical test would identify manufacturing anddesign defects that can cause early mechanicalfailures in service• Omitting mechanical testing can become costly ifdefective chips are shipped to customer3/<strong>2009</strong> Mechanical Reliability Test as Part of Final Test of a Packaged Chip 2Paper #3March 8 - 11, <strong>2009</strong>1
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