ARCHIVE 2009 - BiTS Workshop

More documents

Recommendations

Info

2009Session 3Adventures in Test & Burn-in OperationsHigh Frequency Data1.0 mm pitch,5x5 array 40 mil height0.3 mm pitch,5x5 array 40 mil height3/2009 Mechanical Reliability Test as Part of Final Test of a Packaged Chip 15BGA Interposer3/2009 Mechanical Reliability Test as Part of Final Test of a Packaged Chip 16Paper #3March 8 - 11, 20098
2009Session 3Adventures in Test & Burn-in OperationsBeCe Data for BGA Interposer• 1 mm or 0.8 mm pitch• 1.5 on 8 copper alloy BeCe• 80 mil BeCe height• 14 mil OD• Resistance 7 mΩ• Inductance 0.6 nH• Compliance 20%• Array to 5000 I/O3/2009 Mechanical Reliability Test as Part of Final Test of a Packaged Chip 17LGA Interposer• 0.3mm pitch• 400 I/O• 60 mil high, 6 mil OD• Inductance 0.6 NH• Resistance 20 mΩ• Contact Force
Page 1 and 2: 2009Session 3ARCHIVE 2009ADVENTURES
Page 3 and 4: 2009Session 3Adventures in Test & B
Page 31: 2009Session 3Adventures in Test & B

ARCHIVE 2009 - BiTS Workshop

Create successful ePaper yourself

Delete template?

Save as template?