ARCHIVE 2009 - BiTS Workshop
ARCHIVE 2009 - BiTS Workshop
ARCHIVE 2009 - BiTS Workshop
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<strong>2009</strong>Session 3Adventures in Test & Burn-in OperationsConclusionModulating substrate bias allows:• Increased BI yield due to power/cooling fallout• Optimized BI oven/board resource use• Increased max frequency on slow devices in test/system• Cooling for fast/leaky devices in test/systemThank You!3/<strong>2009</strong> Substrate Bias: Application in Final Test and Burn-in of High-Power CPU’s 15Paper #4March 8 - 11, <strong>2009</strong>8
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