ARCHIVE 2009 - BiTS Workshop

2009Session 3Adventures in Test & Burn-in OperationsTest Socket Requirements• Low & stable resistance of electrical contact– Failure monitoring– High service temperature– High power, high current• Other requirements– High frequency– Large array– Fine contact pitch3/2009 Mechanical Reliability Test as Part of Final Test of a Packaged Chip 11Braided Electrical ContactElement BeCe TM• Meets requirements• Multiple helical springs operating in parallelBeCe SEM Image of Tip as Cut BeCe SEM Image of Tip Plated3/2009 Mechanical Reliability Test as Part of Final Test of a Packaged Chip 12Paper #3March 8 - 11, 20096