ARCHIVE 2009 - BiTS Workshop

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2009Session 3Adventures in Test & Burn-in OperationsPower Cycle Test Details• Heating plate was made from 90 mil thick copper plate.Grooves were cut in the copper plate in which nichrome 60resistance wire was inserted. The heating element was drivenby HB-25 motor controller with PWM frequency of 9.2khz and aload current limit of 25 amps.• 42 watt Thermoelectric/Peltier Module was placed next toheating plate. The device was used in the heating cycle to heatthe device on one side with the added advantage of cooling theheat pipe and the upper aluminum support on the other side. Byreversing the power to the Peltier module we were able toshorten the heating and cooling times.• The heat pipe was placed on top of the Peltier module. Toquickly remove the heat, the other end of the heat pipe was putin an enclosure with a fan.3/2009 Mechanical Reliability Test as Part of Final Test of a Packaged Chip 7Power Cycle Test Details (cont.)• Three thermistors were used to monitor the procedure: one onthe device to be tested, one on the heat pipe next to the heater,and the last on the heat pipe inside the fan enclosure.Temperatures were taken every 1000ms.• The system was controlled and monitored by a Parallax BasicStamp board and processor. The processor ran full power tothe heat plate up to 95 degrees C and then the programadjusted current and timing to maintain 100 degrees C. Afterthe prescribed time holding the temperature at 100 degrees C,the program turned the heat plate off, the fan on, and thereversed voltage to the Peltier module for cooling. Afterreaching 0 degrees C the cycle repeats.3/2009 Mechanical Reliability Test as Part of Final Test of a Packaged Chip 8Paper #3March 8 - 11, 20094
2009Session 3Adventures in Test & Burn-in OperationsDevice Temperature3/2009 Mechanical Reliability Test as Part of Final Test of a Packaged Chip 9Test Socket Requirements• Test socket with integrated power cyclingunit• Monitor changes in resistance duringmechanical testing• Low noise is essential to capture changes inresistance due to crack growth• Most test sockets do not have good enoughelectrical performance3/2009 Mechanical Reliability Test as Part of Final Test of a Packaged Chip 10Paper #3March 8 - 11, 20095
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ARCHIVE 2009 - BiTS Workshop

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