Jens Janssen Diploma Thesis - Prof. Dr. Norbert Wermes ...

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In Chapter 5, a detailed description of USBpix test setup and the equipment,which was used for the measurement, is given. This chapter can be read as a“manual labour” how to set up the USBpix test system.In Chapter 6, the results of the laboratory measurements are presented anddiscussed.4
Chapter 2The LHC Experiment2.1 The LHC AcceleratorThe Large Hadron Collider (LHC, see figure 2.1) is the world’s largest circularcollider located at the international research facility CERN 1 , the EuropeanOrganization for Nuclear Research. The LHC was built into the tunnel of theformer Large Electron-Positron Collider (LEP). The tunnel has a circumferenceof 27 km and is sited approximately 100 m beneath the surface and wasextended to house new experiments at the LHC. The accelerator ring consistsof large superconducting magnets and accelerator structures designed to boostproton pairs up to a center-of-mass energy of Ô s = 14 TeV. Counter-rotatingbunches of particles just mentioned are brought to collision at four distinct interactionpoints distributed along the accelerator ring. The particle bunches arecolliding up to 40, 000, 000 times per second, which corresponds to the bunchcrossing frequency of 40 MHz. Four large detectors (ALICE, ATLAS, CMS andLHCb) are built around these collision points.Figure 2.1: The Large Hadron Collider and its underground structures [1].1 European Organization for Nuclear Research CERN, CH-1211, Genève 23, Switzerland.5
Page 1: Universität BonnPhysikalisches Ins
Page 7: Chapter 1IntroductionThe ATLAS expe
Page 11 and 12: Figure 2.3: Cut-away view of the in
Page 13 and 14: The electromagnetic calorimeter use
Page 15 and 16: Chapter 3Silicon Pixel Detectors3.1
Page 17 and 18: Figure 3.2: Layout and interconnect
Page 19 and 20: (a) (b)Figure 3.4: On top view of t
Page 21: Figure 3.5: The analog pixel block
Page 24 and 25: Figure 3.8: The digital block of th
Page 26 and 27: the digital readout of the chip can
Page 28 and 29: Stopping power [MeV cm 2 /g]100101L
Page 30 and 31: The free charge carriers need to be
Page 32 and 33: The first point particularly concer
Page 34 and 35: Figure 3.14: A 3D n-in-p sensor (le
Page 36 and 37: few µm compared to a few 100 µm).
Page 38 and 39: Figure 4.1: The USBpix test system
Page 40 and 41: e accessed through a 20-bit wide ad
Page 42 and 43: hardware, USBpixdll library uses fu
Page 44 and 45: 100Scan overlaythreshold80604020MSC
Page 46 and 47: mand clock (CCK, 4 MHz 17 ) by mult
Page 48 and 49: aw data word bit [31:0]hit wordw/o
Page 50 and 51: Figure 4.7: Overview of interconnec
Page 52 and 53: SOURCE_SCAN.Module "test"Cluster To
Page 54 and 55: Figure 5.1: The USBpix test setup:
Page 56 and 57: Not only the wafer processing a ect
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2. The tuning was changed to a gain
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FDAC The FDAC is a 3-bit pixel regi
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probability of 50%. Mathematically,
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that the particles first impinge th
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2. Conversion of (clustered) Time-o
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from the expected charge of 10000 e
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6.2 Unirradiated Planar SensorsThe
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Sensor 3631-303 “ATLAS W11 19GR-2
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(a)(b)(c)Figure 6.4: Planar devices
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6.3.1 Results of the Bias ScanLeaka
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(a)(b)Figure 6.7: Leakage current o
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(a)(b)Figure 6.9: FBK 3D devices: m
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Appendix AFE-I3 StandardConfigurati
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Appendix BFPGA ConfigurationRegiste
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Appendix CTuning ResultsThis page i
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Figure C.1: Tuning of the 3631-303
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8642Figure C.3: Tuning of the WR13
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8642Figure C.5: Tuning of the 4EM9
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[13] Peric, I. et al.: The FEI3 rea
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[37] Backhaus, M. et al.: Developme
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Jens Janssen Diploma Thesis - Prof. Dr. Norbert Wermes ...

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