SPIRE Design Description - Research Services

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Draft SPIRE Design Description Document Subsystem Name Detector Control Unit (DCU) Digital Processing Unit (DPU) Warm Interconnect Harness On Board Software (OBS) FPU Simulator DRCU Simulator Description Unit Redundancy Contains the bias conditioning electronics for the bolometers arrays and JFET units and the lock in amplifiers and readout electronics for all the detector arrays. Instrument on board computer – forms interface to CDMS 26 HSDCU No redundancy on the Lock-in Amplifiers. Full redundancy on DAQ. Full redundancy on Bias Generators HSDPU Full redundancy Harnesses between warm boxes HSWIH Full redundancy All on board software that controls the function of the instrument. This is all contained in the DPU A set of electronic components, either passive or active, that mimics the analogue response of the FPU sub-systems to the warm electronics. A set of interface hardware and computer software that mimics the response of the DRCU and FPU to the DPU and on board software. 3.2 The SPIRE instrument as a system HSOBS N.A. HSFPS No redundancy as not a flight item HSDRS No redundancy as not a flight item SPIRE can be viewed not just as a series of physical sub-systems but also as a series of interacting systems. Figure 3-6 is a system topology of the SPIRE instrument that attempts to divide it into a number of systems areas with over lapping areas of interest. Table 3-2 expands on Figure 3-6 and gives details of what each system area represents; the issues to be addressed under each system area; the physical components that can be associated with each system and what methods of analysis and verification we intend using to ensure that each area is properly considered in the implementation of the instrument Although Figure 3-6 and Table 3-2 are a very much-simplified view of the systems interactions in the instrument, they do serve to illustrate some important points about the system level design of SPIRE: The Radiation Detection System – going from the cold detector arrays through to the digitised signals from the DRCU, is at the very heart of the instrument. All systems issues ultimately come back to ensuring that the detection system can operate correctly and without undue interference. The Electrical System and Structure System can be seen as the “glue” that bonds the instrument together into a single unit. The EMC/EMI Protection System touches on virtually every aspect of the instrument design. The issues raised by consideration of the EMC/EMI must always be taken into account in design and implementation of virtually every physical sub-system in the instrument
Draft SPIRE Design Description Document Calibration System Data-Proc. System Electrical System EMC/EMI Protection System Radiation Detection System Optomechanical System Control & Communication System Electromechanical System 27 Thermomechanical system Figure 3-6 – Simplified view of the SPIRE instrument as broken into “systems.” Table 3-2 - Description of the SPIRE systems System Description/Issues Sub-systems Design analysis Structural To ensure that the SPIRE instrument is mechanically compatible with the Herschel system and capable of withstanding the launch environment Mechanical frequency response Ability to withstand launch environment Mechanical interface with Herschel system Instrument level integration Sub-system mechanical interfaces Primarily instrument Structure and JFET enclosures Interfaces to all cold FPU subsystems Tools CAD FEM Structure System Design verification methods Prototype material testing STM/CQM instrument model vibration tests CQM system level integration
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SPIRE Design Description - Research Services

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