PIC24HJ64 Datasheet

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PIC24HJ32GP302/304, <strong>PIC24HJ64</strong>GPX02/X04, AND PIC24HJ128GPX02/X04 NOTES: DS70293B-page 316 Preliminary © 2008 Microchip Technology Inc.
PIC24HJ32GP302/304, <strong>PIC24HJ64</strong>GPX02/X04, AND PIC24HJ128GPX02/X04 28.0 PACKAGING INFORMATION 28-Lead SPDIP Example XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN PIC24HJ32GP 302-E/SP e3 0730235 28-Lead SOIC (.300”) Example XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX YYWWNNN PIC24HJ32GP 302-E/SO e3 0730235 28-Lead QFN-S Example XXXXXXXX XXXXXXXX YYWWNNN 24HJ32GP 302EMM 0730235 44-Lead QFN Example XXXXXXXXXX XXXXXXXXXX XXXXXXXXXX YYWWNNN 44-Lead TQFP PIC 24HJ32GP304 -E/ML e3 0730235 Example XXXXXXXXXX XXXXXXXXXX XXXXXXXXXX YYWWNNN PIC 24HJ32GP304 -I/PT e3 0730235 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN e3 Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. Note: If the full Microchip part number cannot be marked on one line, it is carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2008 Microchip Technology Inc. Preliminary DS70293B-page 317
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PIC24HJ64 Datasheet

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