Part 2

Plug-In Assembly Configuration 527Mounting Components on the Breadboard CardSo that the breadboard card assembly will fit into the 3497A when components areloaded onto the board, the maximum component heightlprotrusion requirementsshown in Figure 166 must be observed. The restrictions shown in Figure 166 assumethat the breadboard will be used in a slot with other plug-in assemblies on eitherside or that the breadboard will be placed in slot 0 or 4 of a 3497A.Absolute maximum component height allowed is 14 mm (.55 inches). However, ifthe height of any component exceeds 10 mm (.4 inches), the conductive surfaceof the component must be insulated. On the circuit side of the breadboard, the leadlengths are limited to 5 mm (.2 inches) or 4 mm (.I6 inches) from the adjacent conductivesurface. If the card is not adjacent to a conductive surface (i.e., noassemblies in adjacent slots or card is not in either of the end slots), these limita-tions can be exceeded.Most wire wrapped components, such as IC sockets, will protrude through the breadboardfurther than the restrictions allow. When using such components, and the cir-cuit side of the breadboard is adjacent to another card or in the far right slot, makesure to cut the lead lengths to meet the restrictions shown in Figure 166.Never mount components where they will occupy space along the extreme top andbottom edges of the breadboard. This space is needed to slide the breadboard intothe grooves of the slot and is labeled "NO COMPONENTS ALONG THIS EDGE".When soldering components on the breadboard, use a soldering iron with a 25 watt(or less) rating and rosin core solder.Be careful to mount components so they are not across the power supply or groundbuses. Also, remember that the analog section has two power supply and twoground buses to accommodate both analog power supply references. The recommendedway to connect power supply and ground for a 14-pin IC, where the supplyconnection is pin 14 and ground is pin 7 is shown in Figure 157. Although Figure157 shows connections on the digital section, it is applicable for the analog sec-tion andlor the third grid as well.NOTEIf component height is greater than lOmm (4in.) the conductive surface of componentsmust be insulated. Lead length protrusion is limited to 5mm 1.2 in.), or 4mrn 1.16 in.)from the adjacent conductive surface.Figure 166. Option 140 -Component HeightIProtrusion RequirementsArtisan Technology Group - Quality Instrumentation ... Guaranteed | (888) 88-SOURCE | www.artisantg.com