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MPhil thesis of Lo Chi Wa - Department of Electronic & Computer ...

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Die LayoutFig. 98 shows the die photo <strong>of</strong> the prototype. It is a 2mm x 2mm tiny chip. It includesthe synthesizer and many test structures for the passive components. Due to the limitedperipheral bonding pads, some <strong>of</strong> the digital inputs for the synthesizers are stored in ashift register while all the analog biasing inputs are connected to the bond pads. Thereference frequency input at 25.6MHz is also connected to the bond pad directly. Theoutput signals <strong>of</strong> the synthesizer at 900MHz are connected to some internal pads whichare probed by a high-impedance probe. The test structures are connected to someinternal pads which are probed by high-speed GSG probes.TS <strong>of</strong> NMOSresistormixer <strong>of</strong> IQmatching testingTS <strong>of</strong> inductorVCO &synthesizerTS <strong>of</strong> cap arrayTS <strong>of</strong> padshift registerTS <strong>of</strong> linear capTS <strong>of</strong> resistance<strong>of</strong> linear capTS <strong>of</strong> varacterTS <strong>of</strong> nwell parasiticTS <strong>of</strong> prescalarFig. 98 Die photo <strong>of</strong> the frequency synthesizer and the test structures101

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