PCT/2001/21 : PCT Gazette, Weekly Issue No. 21, 2001 - WIPO

21/2001
25 May/mai 2001 PCT Gazette - Section I - Gazette du PCT 8731
(54) • AQUEOUS COATING COMPOSITIONS
• COMPOSITIONS AQUEUSES DE RE-
VETEMENT
(71) COGNIS DEUTSCHLAND GMBH
[DE/DE]; Henkelstrasse 67, 40589 Düsseldorf
(DE).
(for all designated States except / pour tous
les États désignés sauf US)
(72, 75) HÖFER, Rainer [DE/DE]; Klever
Strasse 31, 40477 Düsseldorf (DE).
ROLOFF, Thorsten [DE/DE]; Erlanger
Str. 45, 40468 Düsseldorf (DE). HRZIBEK,
Martin [DE/DE]; Hinter den Höfen 5, 40589
Düsseldorf (DE). FOGLIANISI, Vincenzo
[IT/IT]; Viala Bligny, 44, I-20136 Milano
(IT).
(81) CA JP US.
(84) EP (AT BE CH CY DE DK ES FI FR GB GR
IE IT LU MC NL PT SE TR).
(51) 7 C09D 163/02, 5/02
(11) WO 01/36550
(21) PCT/EP00/10887
(13) A1
(22) 4 Nov/nov 2000 (04.11.2000)
(25) de (26) de
(30) 199 54 828.5 13 Nov/nov 1999
(13.11.1999)
DE
(43) 25 May/mai 2001 (25.05.2001)
(54) • AQUEOUS COATING COMPOSITIONS
• COMPOSITIONS AQUEUSES DE RE-
VETEMENT
(71) COGNIS DEUTSCHLAND GMBH
[DE/DE]; Henkelstrasse 67,
seldorf (DE).
40589 Düs-
(for all designated States except / pour tous
les États désignés sauf US)
(72, 75) HÖFER, Rainer [DE/DE]; Klever
Strasse 31, 40477 Düsseldorf (DE).
ROLOFF, Thorsten [DE/DE]; Erlanger
Strasse 45, 40468 Düsseldorf (DE). HRZ-
IBEK, Martin [DE/DE]; Hinter den Höfen
5, 40589 Düsseldorf (DE). FOGLIANISI,
Vincenzo [IT/IT]; Viala Bligny, 44, I-20136
Milano (IT).
(81) CA JP US.
(84) EP (AT BE CH CY DE DK ES FI FR GB GR
IE IT LU MC NL PT SE TR).
(51) 7 C09D 175/04, 133/02
(11) WO 01/36551
(21) PCT/US00/22916
(13) A1
(22) 21 Aug/août 2000 (21.08.2000)
(25) en (26) en
(30) 09/441,810 17 Nov/nov 1999
(17.11.1999)
US
(43) 25 May/mai 2001 (25.05.2001)
(54) • WATERBORNE PRIMER WITH IM-
PROVED CHIP RESISTANCE
• COUCHE D’APPRET EN PHASE
AQUEUSE PRESENTANT UNE RE-
SISTANCE A L’ECAILLEMENT AME-
LIOREE
(71) BASF CORPORATION [US/US]; Patent
Department, 26701 Telegraph Road, Southfield,
MI 48034-2442 (US).
(for all designated States except / pour tous
les États désignés sauf US)
(72, 75) GESSNER, Michael [US/US]; 5494
Fox Ridge Drive, West Bloomfield, MI
48322 (US). KANDOW, Timothy [US/US];
1987 Sundance Ridge, Howell, MI 48843
(US).
(74) SABOURIN, Anne, Gerry et al. / etc.;
BASF Corporation, 26701 Telegraph Road,
Southfield, MI 48034-2442 (US).
(81) AE AG AL AM AT AU AZ BA BB BG BR
BY BZ CA CH CN CR CU CZ DE DK DM
DZ EE ES FI GB GD GE GH GM HR HU
ID IL IN IS JP KE KG KP KR KZ LC LK
LR LS LT LU LV MA MD MG MK MN MW
MX MZ NO NZ PL PT RO RU SD SE SG SI
SK SL TJ TM TR TT TZ UA UG US UZ VN
YU ZA ZW.
(84) AP (GH GM KE LS MW MZ SD SL SZ TZ
UG ZW); EA (AM AZ BY KG KZ MD RU
TJ TM); EP (AT BE CH CY DE DK ES FI FR
GB GR IE IT LU MC NL PT SE); OA (BF BJ
CF CG CI CM GA GN GW ML MR NE SN
TD TG).
(51) 7 C09D 175/04, C08F 283/00, C08G 18/72
(11) WO 01/36552 (13) A1
(21) PCT/US00/22918
(22) 21 Aug/août 2000 (21.08.2000)
(25) en (26) en
(30) 09/442,420 17 Nov/nov 1999 US
(17.11.1999)
(43) 25 May/mai 2001 (25.05.2001)
(54) • WATERBORNE PRIMER WITH IM-
PROVED CHIP RESISTANCE
• REVETEMENT PRIMAIRE A BASE
D’EAU AYANT UNE RESISTANCE A
L’ECAILLAGE AMELIOREE
(71) BASF CORPORATION [US/US]; 26701
Telegraph Road, Southfield, MI 48034-2442
(US).
(for all designated States except / pour tous
les États désignés sauf US)
(72, 75) GRANDHEE, Sunitha [IN/US]; 22109
Greentree, Novi, MI 48375 (US).
(74) SABOURIN, Anne, Gerry et al. / etc.;
BASF Corporation, 26701 Telegraph Road,
Southfield, MI 48034-2442 (US).
(81) AE AG AL AM AT AU AZ BA BB BG BR
BY BZ CA CH CN CR CU CZ DE DK DM
DZ EE ES FI GB GD GE GH GM HR HU
ID IL IN IS JP KE KG KP KR KZ LC LK
LR LS LT LU LV MA MD MG MK MN MW
MX MZ NO NZ PL PT RO RU SD SE SG SI
SK SL TJ TM TR TT TZ UA UG US UZ VN
YU ZA ZW.
(84) AP (GH GM KE LS MW MZ SD SL SZ TZ
UG ZW); EA (AM AZ BY KG KZ MD RU
TJ TM); EP (AT BE CH CY DE DK ES FI FR
GB GR IE IT LU MC NL PT SE); OA (BF BJ
CF CG CI CM GA GN GW ML MR NE SN
TD TG).
(51) 7 C09D 201/00, 201/06, 7/12, A41D 19/00,
B32B 25/08 // A61B 19/04
(11) WO 01/36553 (13) A1
(21) PCT/JP00/08164
(22) 20 Nov/nov 2000 (20.11.2000)
(25) ja (26) ja
(30) 11/327825 18 Nov/nov 1999 JP
(18.11.1999)
(43) 25 May/mai 2001 (25.05.2001)
(54) • COATING MATERIAL AND MOLDED
ARTICLE
• MATERIAU DE REVETEMENT ET AR-
TICLE MOULE
(71) ZEON CORPORATION [JP/JP]; 6-1,
Marunouchi 2-chome, Chiyoda-ku, Tokyo
100-8323 (JP).
(for all designated States except / pour tous
les États désignés sauf US)
(72, 75) NAKAMURA, Misao [JP/JP]; Research
& Development Center, Zeon Corporation,
2-1, Yako 1-chome, Kawasaki-ku,
Kawasaki-shi, Kanagawa 210-9507 (JP).
INOUE, Toshihiro [JP/JP]; Research &
Development Center, Zeon Corporation, 2-1,
Yako 1-chome, Kawasaki-ku, Kawasaki-shi,
Kanagawa 210-9507 (JP).
(74) WADA, Yasuro; Zeon Corporation, 6-1,
Marunouchi 2-chome, Chiyoda-ku, Tokyo
100-8323 (JP).
(81) JP US.
(84) EP (AT BE CH CY DE DK ES FI FR GB GR
IE IT LU MC NL PT SE TR).
Published / Publiée :(c)
(51) 7 C09G 1/02, C09K 3/14, H01L 21/321
(11) WO 01/36554 (13) A1
(21) PCT/US00/31653
(22) 15 Nov/nov 2000 (15.11.2000)
(25) en (26) en
(30) 09/440,401 15 Nov/nov 1999 US
(15.11.1999)
(30) 09/625,142 25 Jul/juil 2000 US
(25.07.2000)
(43) 25 May/mai 2001 (25.05.2001)
(54) • COMPOSITION AND METHOD FOR
PLANARIZING SURFACES
• COMPOSITION ET PROCEDE DE PLA-
NARISATION DE SURFACES
(71) CABOT MICROELECTRONICS COR-
PORATION [US/US]; 870 Commons Drive,
Aurora, IL 60504 (US).
(72) FANG, Mingming; 6 South Naper Boulevard
#12, Naperville, IL 60540 (US).
MUELLER, Brian, L.; 1990 North Alma
School Road #211, Chandler, AZ 85224
(US). DIRKSEN, James, A.; 225 Ashley
Court, Oswego, IL 60543 (US).
(74) KILYK, John, Jr. et al. / etc.; Leydig, Voit
& Mayer, Ltd., Suite 4900, Two Prudential
Plaza, 180 North Stetson, Chicago, IL 60601-
6780 (US).
(81) AE AG AL AM AT AU AZ BA BB BG BR
BY BZ CA CH CN CR CU CZ DE DK DM
DZ EE ES FI GB GD GE GH GM HR HU
ID IL IN IS JP KE KG KP KR KZ LC LK
LR LS LT LU LV MA MD MG MK MN MW
MX MZ NO NZ PL PT RO RU SD SE SG SI
SK SL TJ TM TR TT TZ UA UG UZ VN YU
ZA ZW.
(84) AP (GH GM KE LS MW MZ SD SL SZ TZ
UG ZW); EA (AM AZ BY KG KZ MD RU
TJ TM); EP (AT BE CH CY DE DK ES FI
FR GB GR IE IT LU MC NL PT SE TR); OA