PCT/2001/21 : PCT Gazette, Weekly Issue No. 21, 2001 - WIPO

21/2001
25 May/mai 2001 PCT Gazette - Section I - Gazette du PCT 8931
(71) ORGA KARTENSYSTEME GMBH
[DE/DE]; Am Hoppenhof 33, 33104 Paderborn
(DE).
(for all designated States except / pour tous
les États désignés sauf US)
(72, 75) SENGE, Carsten [DE/DE]; Scharnhorststrasse
22, 24105 Kiel (DE). STAUDT,
Mathias [DE/DE]; Rendsburger Landstrasse
123, 24113 Kiel (DE). MENTZER, Rüdiger
[DE/DE]; Milower Weg 9, 24783 Osterrönfeld
(DE).
(81) AE AG AL AM AT AU AZ BA BB BG BR
BY BZ CA CH CN CR CU CZ DK DM DZ
EE ES FI GB GD GE GH GM HR HU ID IL
IN IS JP KE KG KP KR KZ LC LK LR LS
LT LU LV MA MD MG MK MN MW MX
MZ NO NZ PL PT RO RU SD SE SG SI SK
SL TJ TM TR TT TZ UA UG US UZ VN YU
ZA ZW.
(84) AP (GH GM KE LS MW MZ SD SL SZ TZ
UG ZW); EA (AM AZ BY KG KZ MD RU
TJ TM); EP (AT BE CH CY DE DK ES FI
FR GB GR IE IT LU MC NL PT SE TR); OA
(BF BJ CF CG CI CM GA GN GW ML MR
NE SN TD TG).
(51) 7 H05K 3/00
(11) WO 01/37622 (13) A2
(21) PCT/DE00/03933
(22) 10 Nov/nov 2000 (10.11.2000)
(25) de (26) de
(30) 199 55 538.9 18 Nov/nov 1999 DE
(18.11.1999)
(43) 25 May/mai 2001 (25.05.2001)
(54) PRINTED CONDUCTOR SUPPORT
LAYER FOR LAMINATING INTO A
CHIP CARD, METHOD FOR PRO-
DUCING A PRINTED CONDUCTOR
SUPPORT LAYER AND INJECTION
MOLDING TOOL FOR CARRYING
OUT THE METHOD FOR PRODUCING
A PRINTED CONDUCTOR SUPPORT
LAYER
COUCHE SUPPORT DE CONDUC-
TEURS IMPRIMES DESTINEE A ETRE
INSEREE PAR LAMINAGE DANS
UNE CARTE A PUCE, PROCEDE DE
PRODUCTION DE CETTE COUCHE,
MOULE DE MOULAGE PAR INJEC-
TION PERMETTANT DE METTRE EN
OEUVRE LE PROCEDE DE PRODUC-
TION DE CETTE COUCHE SUPPORT
(71) ORGA KARTENSYSTEME GMBH
[DE/DE]; Am Hoppenhof 33, 33104 Paderborn
(DE).
(for all designated States except / pour tous
les États désignés sauf US)
(72, 75) SENGE, Carsten [DE/DE]; Scharnhorststrasse
22, 24105 Kiel (DE).
(81) AE AG AL AM AT AU AZ BA BB BG BR
BY BZ CA CH CN CR CU CZ DK DM DZ
EE ES FI GB GD GE GH GM HR HU ID IL
IN IS JP KE KG KP KR KZ LC LK LR LS
LT LU LV MA MD MG MK MN MW MX
MZ NO NZ PL PT RO RU SD SE SG SI SK
SL TJ TM TR TT TZ UA UG US UZ VN YU
ZA ZW.
(84) AP (GH GM KE LS MW MZ SD SL SZ TZ
UG ZW); EA (AM AZ BY KG KZ MD RU
TJ TM); EP (AT BE CH CY DE DK ES FI
FR GB GR IE IT LU MC NL PT SE TR); OA
(BF BJ CF CG CI CM GA GN GW ML MR
NE SN TD TG).
(51) 7 H05K 3/12, 3/06, B41C 1/05, B41M 3/00
(11) WO 01/37623 (13) A1
(21) PCT/EP00/11272
(22) 15 Nov/nov 2000 (15.11.2000)
(25) de (26) de
(30) 199 55 214.2 17 Nov/nov 1999 DE
(17.11.1999)
(43) 25 May/mai 2001 (25.05.2001)
(54) METHOD FOR PRODUCING CON-
DUCTIVE PATTERNS
PROCEDE DE PRODUCTION DE DES-
SINS DE CONDUCTEURS
(71) STORK GMBH [DE/DE]; Otto-Hahn-
Strasse 5, 63165 Mühlheim/Main (DE).
(for all designated States except / pour tous
les États désignés sauf US)
(72, 75) BEIER, Wolfgang [DE/DE]; Pröttitzer
Weg 2, 04129 Leipzig (DE). RÖHRS,
Günther [DE/DE]; Gartenweg 9, 01762
Obercarsdorf (DE). SCHEEL, Wolfgang
[DE/DE]; Mollstrasse 7, 10178 Berlin (DE).
FILOR, Uwe [DE/DE]; Waldspirale 8, 64289
Darmstadt (DE). STORK, Martin [DE/DE];
Otto-Hahn-Strasse 5, 63165 Mühlheim/Main
(DE).
(74) ZOUNEK, Nikolai et al. / etc.; Patentanwaltskanzlei
Zounek, Industriepark Kalle-Albert,
Rheingaustrasse 190-196, 65203 Wiesbaden
(DE).
(81) AE AL AM AT AU AZ BA BB BG BR BY
CA CH CN CR CU CZ DE DK DM EE ES FI
GB GD GE GH GM HR HU ID IL IN IS JP
KE KG KP KR KZ LC LK LR LS LT LU LV
MA MD MG MK MN MW MX NO NZ PL
PT RO RU SD SE SG SI SK SL TJ TM TR
TT TZ UA UG US UZ VN YU ZA ZW.
(84) AP (GH GM KE LS MW MZ SD SL SZ TZ
UG ZW); EA (AM AZ BY KG KZ MD RU
TJ TM); EP (AT BE CH CY DE DK ES FI
FR GB GR IE IT LU MC NL PT SE TR); OA
(BF BJ CF CG CI CM GA GN GW ML MR
NE SN TD TG).
Published / Publiée :(c)
(51) 7 H05K 3/36, 3/34
(11) WO 01/37624
(21) PCT/GB00/04356
(13) A1
(22) 16 Nov/nov 2000 (16.11.2000)
(25) en (26) en
(30) 09/441,334 16 Nov/nov 1999
(16.11.1999)
US
(43) 25 May/mai 2001 (25.05.2001)
(54) APPARATUS AND METHOD FOR
CONNECTING PRINTED CIRCUIT
BOARDS THROUGH SOLDERED LAP
JOINTS
APPAREIL ET PROCEDE POUR RE-
LIER DES PLAQUETTES DE CIRCUITS
IMPRIMES PAR DES JOINTS SOUDES
SE CHEVAUCHANT
(71) VISTEON GLOBAL TECHNOLOGIES,
INC [US/US]; Suite 728, Parklane Towers
East, One Parklane Boulevard, Dearborn, MI
48126 (US).
(71) GEMMELL, Peter, Alan [GB/GB]; Dummett
Copp, 25 The Square, Martlesham
Heath, Ipswich, Suffolk IP5 3SL (GB).
(only for / seulement pour MG)
(72) WONG, Stephen, H., P.; 31 Fonthill Boulevard
11/96, Markham, Ontario L3R 1V5
(CA). KIANG, Billy; 23 Touraine Drive,
Markham, Ontario L6C 1T1 (CA).
(74) GEMMELL, Peter, Alan et al. / etc.;
Dummett Copp, 25 The Square, Martlesham
Heath, Ipswich IP5 3SL (GB).
(81) BR CA JP KR MG.
(84) EP (AT BE CH CY DE DK ES FI FR GB GR
IE IT LU MC NL PT SE TR).
(51) 7 H05K 9/00, G12B 17/02
(11) WO 01/37625 (13) A1
(21) PCT/KR00/01300
(22) 14 Nov/nov 2000 (14.11.2000)
(25) ko (26) en
(30) 1999/50518 15 Nov/nov 1999 KR
(15.11.1999)
(43) 25 May/mai 2001 (25.05.2001)
(54) HARMFUL EARTH-RAY SHIELDING
SYSTEM
SYSTEME DE PROTECTION CONTRE
LES RAYONNEMENTS TERRESTRES
NOCIFS
(71) HUMAN FREE CO., LTD. [KR/KR]; Pung
Lim Building 1528 Ho, 404, Kong Duk-dong,
Mapo-ku, Seoul 121-020 (KR).
(for all designated States except / pour tous
les États désignés sauf US)
(72, 75) KWEON, Kwang-hee [KR/KR];
309-33, Inchang-dong, Guri-city, Kyunggi-do
471-010 (KR).
(74) SONG, Han-Chun; H.Song & Associates
Intellectual Property Law Firm, 2nd Floor,
Namdo Building,, 823-24 Yeoksam-dong,
Kangnam-gu, Seoul 135-080 (KR).
(81) AE AG AL AM AT AU AZ BA BB BG BR
BY BZ CA CH CN CR CU CZ DE DK DM
DZ EE ES FI GB GD GE GH GM HR HU ID
IL IN IS JP KE KG KP KZ LC LK LR LS LT
LU LV MA MD MG MK MN MW MX MZ
NO NZ PL PT RO RU SD SE SG SI SK SL
TJ TM TR TT TZ UA UG US UZ VN YU ZA
ZW.
(84) AP (GH GM KE LS MW MZ SD SL SZ TZ
UG ZW); EA (AM AZ BY KG KZ MD RU
TJ TM); EP (AT BE CH CY DE DK ES FI
FR GB GR IE IT LU MC NL PT SE TR); OA
(BF BJ CF CG CI CM GA GN GW ML MR
NE SN TD TG).
Published / Publiée :(c)
(51) 7 H05K 13/00
(11) WO 01/37626
(21) PCT/NL00/00826
(13) A2
(22) 10 Nov/nov 2000 (10.11.2000)
(25) nl (26) en
(30) 1013569 12 Nov/nov 1999
(12.11.1999)
NL
(43) 25 May/mai 2001 (25.05.2001)
(54) TRANSPORT DEVICE AND METHOD
FOR DISPLACING PRODUCT CAR-
RIERS FOR ELECTRONIC COMPO-
NENTS