PCT/2001/21 : PCT Gazette, Weekly Issue No. 21, 2001 - WIPO

21/2001
8878 PCT Gazette - Section I - Gazette du PCT 25 May/mai 2001
HIGH DENSITY, HIGH PERFOR-
MANCE DRAMS
STRUCTURE ET METHODE POUR
OXYDATION DES FLANCS DE
GRILLE DE PORTE SUR DES PUCES
DRAM HAUTES PERFORMANCES
(71) INFINEON TECHNOLOGIES NORTH
AMERICA CORP. [US/US]; 1730 North
First Street, San Jose, CA 95112-4508
(US). INTERNATIONAL BUSINESS MA-
CHINES CORPORATION [US/US]; New
Orchard Road, Armonk, NY 10504 (US).
(72) BRONNER, Gary, B.; 35 Woodcliff Drive,
Stormville, NY 12582 (US). DIVAKARUNI,
Rama; 219 Berkman Drive, Middletown, NY
10941 (US). HALLE, Scott; 45 Innsbruck
Blvd., Hopewell Junction, NY 12533 (US).
RENGARAJAN, Rajesh; 1206 Hudson
Harbor Drive, Poughkeepsie, NY 12601
(US). WEYBRIGHT, Mary, E.; 7 Brenner
Ridge Road, Pleasant Valley, NY 12569 (US).
MARTIN, Dale, W.; 564 Vt. 15 West, Hyde
Park, VT 05655 (US).
(74) BRADEN, Stanton, C. et al. / etc.; Siemens
Corporation - Intellectual Property Dept., 186
Wood Ave. South, Iselin, NJ 08830 (US).
(81) JP KR.
(84) EP (AT BE CH CY DE DK ES FI FR GB GR
IE IT LU MC NL PT SE).
Published / Publiée :(c)
(51) 7 H01L 23/13
(11) WO 01/37335
(21) PCT/EP00/11254
(13) A2
(22) 14 Nov/nov 2000 (14.11.2000)
(25) de (26) de
(30) 199 54 888.9 15 Nov/nov 1999
(15.11.1999)
DE
(43) 25 May/mai 2001 (25.05.2001)
(54) PACKAGING FOR A SEMICONDUC-
TOR CHIP
CONDITIONNEMENT POUR PUCE DE
SEMI-CONDUCTEUR
(71) INFINEON TECHNOLOGIES AG
[DE/DE]; St.-Martin-Strasse 53, 81541
München (DE).
(for all designated States except / pour tous
les États désignés sauf US)
(72, 75) KAHLISCH, Knut [DE/DE]; Meisensteig
5, 01109 Dresden (DE). STRUTZ,
Volker [DE/DE]; Wiedmannstrasse 22,
93105 Tegernheim (DE).
(74) BARTH, Stephan; Reinhard, Skuhra, Weise
& Partner GbR, Postfach 44 01 51, 80750
München (DE).
(81) CN JP KR US.
(84) EP (AT BE CH CY DE DK ES FI FR GB GR
IE IT LU MC NL PT SE TR).
(51) 7 H01L 23/14, 25/16
(11) WO 01/37336 (13) A1
(21) PCT/EP00/10608
(22) 26 Oct/oct 2000 (26.10.2000)
(25) en (26) en
(30) 09/440,595 15 Nov/nov 1999
(15.11.1999)
(43) 25 May/mai 2001 (25.05.2001)
US
(54) MULTI-CHIP MODULE FOR USE IN
HIGH-POWER APPLICATIONS
MODULE MULTIPUCE UTILISE DANS
DES APPLICATIONS DE FORTE IN-
TENSITE
(71) KONINKLIJKE PHILIPS ELECTRON-
ICS N.V. [NL/NL]; Groenewoudseweg 1,
NL-5621 BA Eindhoven (NL).
(72) MAJID, Naveed; Prof. Holstlaan 6,
NL-5656 AA Eindhoven (NL). MOBERS,
Ton; Prof. Holstlaan 6, NL-5656 AA Eindhoven
(NL). MUKHERJEE, Satyen; Prof.
Holstlaan 6, NL-5656 AA Eindhoven (NL).
(74) DUIJVESTIJN, Adrianus, J.; Internationaal
Octrooibureau B.V., Prof.
NL-5656 AA Eindhoven (NL).
(81) JP KR.
Holstlaan 6,
(84) EP (AT BE CH CY DE DK ES FI FR GB GR
IE IT LU MC NL PT SE).
(51) 7 H01L 23/48, 23/52, 23/02, 23/04
(11) WO 01/37337
(21) PCT/US00/25055
(13) A1
(22) 13 Sep/sep 2000 (13.09.2000)
(25) en (26) en
(30) 09/440,630 15 Nov/nov 1999
(15.11.1999)
US
(43) 25 May/mai 2001 (25.05.2001)
(54) BALL GRID SUBSTRATE FOR
LEAD-ON-CHIP
PACKAGE
SEMICONDUCTOR
SUBSTRAT MATRICIEL A BILLES
POUR BOITIER A SEMICONDUC-
TEUR FIL SUR PUCE
(71) SUBSTRATE TECHNOLOGIES, INC.
[US/US]; Suite 114, 2410 Luna Road, Carrollton,
TX 75006 (US).
(72) CASTRO, Abram, M.; 4701 Meadowbrook
Drive, Fort Worth, TX 76103 (US).
(74) MEYERS, Philip, G. et al. / etc.; Intellectual
Property Law PC, Suite 114, 3121 Cross Timbers
Road, Flower Mound, TX 75028 (US).
(81) CN JP KR SG.
(84) EP (AT BE CH CY DE DK ES FI FR GB GR
IE IT LU MC NL PT SE).
(51) 7 H01L 23/498
(11) WO 01/37338
(21) PCT/EP00/11380
(13) A2
(22) 16 Nov/nov 2000 (16.11.2000)
(25) de (26) de
(30) 199 54 941.9 16 Nov/nov 1999
(16.11.1999)
DE
(43) 25 May/mai 2001 (25.05.2001)
(54) METHOD FOR INTEGRATING A CHIP
IN A PRINTED BOARD AND INTE-
GRATED CIRCUIT
PROCEDE D’INTEGRATION D’UNE
PUCE DANS UNE PLAQUETTE ET
CIRCUIT INTEGRE
(71) FRAUNHOFER-GESELLSCHAFT ZUR
FÖRDERUNG DER ANGEWANDTEN
FORSCHUNG E. V. [DE/DE]; Leonrodstrasse
54, 80636 München (DE).
(for all designated States except / pour tous
les États désignés sauf US)
(72, 75) JUNG, Erik [DE/DE]; Flatowallee 16,
14055 Berlin (DE). OSTMANN, Andreas
[DE/DE]; Krumme Strasse 6, 10585 Berlin
(DE). LANDESBERGER, Christoph
[DE/DE]; Oswald-Bieber-Weg 7, 81241
München (DE).
(74) SCHOPPE, Fritz et al. / etc.; Schoppe, Zimmermann,
Stöckeler & Zinkler, Postfach 71
08 67, 81458 München (DE).
(81) JP US.
(84) EP (AT BE CH CY DE DK ES FI FR GB GR
IE IT LU MC NL PT SE TR).
(51) 7 H01L 23/522, 21/768, 21/764
(11) WO 01/37339 (13) A1
(21) PCT/US00/29519
(22) 27 Oct/oct 2000 (27.10.2000)
(25) en (26) en
(30) 09/439,098 12 Nov/nov 1999 US
(12.11.1999)
(43) 25 May/mai 2001 (25.05.2001)
(54) AIR GAP DIELECTRIC IN SELF-
ALIGNED VIA STRUCTURES
DIELECTRIQUE A ENTREFERS POUR
STRUCTURES DE PASSAGES A AUTO-
ALIGNEMENT
(71) KONINKLIJKE PHILIPS ELECTRON-
ICS N.V. [NL/NL]; Groenewoudseweg 1,
NL-5621 BA Eindhoven (NL).
(71) PHILIPS SEMICONDUCTORS, INC.
[US/US]; 811 East Arques Avenue, Sunnyvale,
CA 94088 (US).
(only for / seulement pour MC)
(72) BOTHRA, Subhas; 230 Prairie Dog Lane,
Fremont, CA 94539 (US).
(74) PENILLA, Albert, S.; Martine, Penilla &
Kim, LLP, 710 Lakeway Drive, Suite 170,
Sunnyvale, CA 94085 (US).
(81) CN JP KR.
(84) EP (AT BE CH CY DE DK ES FI FR GB GR
IE IT LU MC NL PT SE).
(51) 7 H01L 23/525, 21/768
(11) WO 01/37340
(21) PCT/US00/29735
(13) A1
(22) 26 Oct/oct 2000 (26.10.2000)
(25) en (26) en
(30) 09/440,103 15 Nov/nov 1999
(15.11.1999)
US
(43) 25 May/mai 2001 (25.05.2001)
(54) PROGRAMMABLE SEMICONDUC-
TOR DEVICE STRUCTURES AND
METHODS FOR MAKING THE SAME
STRUCTURES DE COMPOSANTS A
SEMI-CONDUCTEUR PROGRAM-
MABLES ET PROCEDES DE FABRI-
CATION DE TELLES STRUCTURES
(71) KONINKLIJKE PHILIPS ELECTRON-
ICS N.V. [NL/NL]; Groenewoudseweg 1,
NL-5621 BA Eindhoven (NL).
(71) PHILIPS SEMICONDUCTORS, INC.
[US/US]; 811 East Arques Avenue, Sunnyvale,
CA 94088 (US).
(only for / seulement pour MC)
(72) BOTHRA, Subhas; 230 Prairie Dog Lane,
Fremont, CA 94539 (US).