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Kinetic Analysis and Characterization of Epoxy Resins ... - FedOA

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Results <strong>and</strong> Discussion 117<br />

Tables 3.10, 3.11 <strong>and</strong> 3.12.<br />

Residual Enthalpy versus Time for P = 1000 W<br />

Time [s]<br />

∆H RES [J/g]<br />

100 415,7<br />

150 349,1<br />

200 139,1<br />

250 86,07<br />

300 9,48<br />

350 ≈ 0<br />

Table 3.10:<br />

Residual enthalpy against time during MW cure process at<br />

1000 W.<br />

In every case a sharp decrease <strong>of</strong> residual enthalpy is observed after a time<br />

depending on the heating rate <strong>and</strong>, therefore on the radiation power.<br />

For example in Figure 3.14 the residual enthalpy after a microwave cure process<br />

at 1500 W for 125 s is shown.<br />

During these partial crosslinking reactions the sample temperatures have been<br />

recorded every 0,5 s by datalogger 10 .<br />

For a clearer representation <strong>of</strong> the data,<br />

only the temperatures corresponding to the time, chosen for the residual enthalpy<br />

measurement, have been plotted.<br />

The thermal pr<strong>of</strong>ile, followed by the system<br />

during the cure process at the power <strong>of</strong> 1000 W, illustrated in Figure 3.15, is<br />

not reproducible with a simple DSC dynamic scan <strong>and</strong> therefore, at least for the<br />

comparison between MW <strong>and</strong> DSC, has been discarded. While the thermal pr<strong>of</strong>iles<br />

during the cure at 1500 W <strong>and</strong> 2000 W are well comparable with DSC dynamic<br />

scan, respectively at 44 <strong>and</strong> 70 ◦ C/min, at least for the main part <strong>of</strong> the reaction<br />

10 Described in the section 2.5 on page 83.<br />

117

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