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Kinetic Analysis and Characterization of Epoxy Resins ... - FedOA

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Results <strong>and</strong> Discussion 121<br />

Figure 3.17: Comparison <strong>of</strong> thermal pr<strong>of</strong>ile between MW cure process at<br />

2000 W <strong>and</strong> a DSC dynamic scan at 70 ◦ C/min.<br />

Figure 3.18: DSC dynamic scan at 70 ◦ C/min on an indium sample.<br />

121

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