Kinetic Analysis and Characterization of Epoxy Resins ... - FedOA
Kinetic Analysis and Characterization of Epoxy Resins ... - FedOA
Kinetic Analysis and Characterization of Epoxy Resins ... - FedOA
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Results <strong>and</strong> Discussion 98<br />
Figure 3.5: T g <strong>of</strong> a sample cured with dynamic scan at 10 ◦ C/min.<br />
value <strong>of</strong> specific heat flow.<br />
The average values <strong>of</strong> the cure enthalpy <strong>and</strong> <strong>of</strong> the glass transition temperature<br />
are shown in Table 3.2.<br />
∆H TOT [J/g] T g [ ◦ C]<br />
485 106,21<br />
Table 3.2: Average values <strong>of</strong> ∆H TOT <strong>and</strong> T g .<br />
While the glass transition temperature <strong>of</strong> an epoxy sample microwave cured<br />
with the operative conditions listed in Table 3.3, measured through a DSC dynamic<br />
scan at heating rate <strong>of</strong> 10 ◦ C/min from 0 up to 225 ◦ C is illustrated in Figure 3.6.<br />
No residual energy is present, so these operative conditions have allowed a complete<br />
conversion <strong>of</strong> the sample. However the system has been heated for a longer time<br />
than that elapsed during the DSC dynamic cure at 10 ◦ C/min. Therefore the T g<br />
in this case is slightly lower for two reasons:<br />
1. During this prolonged heating time thermal degradation phenomena have<br />
been occurred;<br />
98