Kinetic Analysis and Characterization of Epoxy Resins ... - FedOA
Kinetic Analysis and Characterization of Epoxy Resins ... - FedOA
Kinetic Analysis and Characterization of Epoxy Resins ... - FedOA
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Experimental 85<br />
same reason a wood 22 table <strong>of</strong> the same logger size has been put on it.<br />
For improving the reliability <strong>of</strong> temperature measurement the tip <strong>of</strong> the stem<br />
has been spread with thermoconductive oil. The tip has been placed under the<br />
bottom <strong>of</strong> the vessel for avoiding mechanical <strong>and</strong> electrical interferences with the<br />
epoxy mixture. The sample has been positioned on a disc <strong>of</strong> teflon at about 2 cm<br />
<strong>of</strong> height.<br />
The aluminum box has been hermetically closed for preventing the damage <strong>of</strong><br />
the electronic circuits.<br />
The datalogger has been used only during the experiments performed in static<br />
operative conditions, because with movable tray two unwanted phenomena occur:<br />
1. Mechanical vibrations impeding an accurate temperature measurement;<br />
2. Onset <strong>of</strong> parasitic electric currents along the stem generating remarkable<br />
temperature overshoots.<br />
2.6 Optimization <strong>of</strong> the Process Conditions<br />
For exploiting the full potentiality <strong>of</strong> the microwave oven 23 for the polymerization<br />
<strong>of</strong> the epoxy system it is necessary to place the sample in the centre <strong>of</strong> the<br />
applicator cavity at 2 cm <strong>of</strong> height, when the plant operates with moving tray, or<br />
in the position <strong>of</strong> coordinates (0,-5,2) [cm], when the it works as a static cavity.<br />
In dynamic operative conditions the tray velocity <strong>of</strong> 224 cm/min has been also<br />
selected for safety reason.<br />
A preliminary qualitative optimization <strong>of</strong> the operative conditions has been<br />
carried out for the best performance <strong>of</strong> the microwave curing processes.<br />
22 Material microwave sensitive.<br />
23 As verified through its characterization.<br />
85